Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00017
Mark Neisser, Harry J. Levinson, S. Wurm, D. Kyser, Takeo Watanabe, Kenneth P. MacWilliams, H. Ishiuchi, W. Trybula, Naoya Hayashi, Ted Fedynyshyn, Craig Higgins, Tsuyoshi Nakamura, Douglas J. Resnick, Moshe E. Preil, M. Lercel, Hajime Aoyama, E. Hosler
Historically, improvements in lithography have enabled improved chip technologies. The International Roadmap for Devices and Systems (IRDS) Lithography roadmap predicts where current patterning capability can support future chip generations and where challenges and improvements are needed. It is intended to be used by semiconductor industry participants, by industry analysts, and by researchers who want or need to know how the industry will evolve in the future and what challenges need to be addressed.
{"title":"Lithography","authors":"Mark Neisser, Harry J. Levinson, S. Wurm, D. Kyser, Takeo Watanabe, Kenneth P. MacWilliams, H. Ishiuchi, W. Trybula, Naoya Hayashi, Ted Fedynyshyn, Craig Higgins, Tsuyoshi Nakamura, Douglas J. Resnick, Moshe E. Preil, M. Lercel, Hajime Aoyama, E. Hosler","doi":"10.1109/irds54852.2021.00017","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00017","url":null,"abstract":"Historically, improvements in lithography have enabled improved chip technologies. The International Roadmap for Devices and Systems (IRDS) Lithography roadmap predicts where current patterning capability can support future chip generations and where challenges and improvements are needed. It is intended to be used by semiconductor industry participants, by industry analysts, and by researchers who want or need to know how the industry will evolve in the future and what challenges need to be addressed.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124509080","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/smtw.2004.1393719
D. Wilcox, Slava Libman
The Yield Enhancement focus area is dedicated to activity ensuring that semiconductor manufacturing set up is optimized towards identifying, reducing, and avoiding yield-relevant defects and contamination.
良率提高重点领域致力于确保半导体制造设置优化，以识别，减少和避免与良率相关的缺陷和污染。
{"title":"Yield Enhancement","authors":"D. Wilcox, Slava Libman","doi":"10.1109/smtw.2004.1393719","DOIUrl":"https://doi.org/10.1109/smtw.2004.1393719","url":null,"abstract":"The Yield Enhancement focus area is dedicated to activity ensuring that semiconductor manufacturing set up is optimized towards identifying, reducing, and avoiding yield-relevant defects and contamination.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124780679","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00014
M. Garner
The Internet of Everything (IoE) is continuing to expand in applications that demand higher volumes of higher performance communication. The IoE was initially defined as a wide range of Internet of Things (IoT) devices communicating with cloud computing that store data and which was analyzed with applications and actions communicated. As IoE was used for a broader range of applications, some applications had unacceptably slow performance due to the latency of communicating with the cloud. To overcome this latency limitation, some applications added local storage and processing close to the IoT devices and network, which is referred to as fog computing.
{"title":"Outside System Connectivity","authors":"M. Garner","doi":"10.1109/irds54852.2021.00014","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00014","url":null,"abstract":"The Internet of Everything (IoE) is continuing to expand in applications that demand higher volumes of higher performance communication. The IoE was initially defined as a wide range of Internet of Things (IoT) devices communicating with cloud computing that store data and which was analyzed with applications and actions communicated. As IoE was used for a broader range of applications, some applications had unacceptably slow performance due to the latency of communicating with the cloud. To overcome this latency limitation, some applications added local storage and processing close to the IoT devices and network, which is referred to as fog computing.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121625408","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00016
Supika Mashiro, J. Moyne
The Factory Integration (FI) chapter of the IRDS is dedicated to ensuring that the microelectronics manufacturing infrastructure contains the necessary components to produce items at affordable cost and high volume. Realizing the potential of Moore's Law requires taking full advantage of device feature size reductions, new materials, yield improvement to near 100%, wafer size increases, and other manufacturing productivity improvements. This in turn requires a factory system that can fully integrate additional factory components and utilize these components collectively to deliver items that meet specifications determined by other IRDS international focus teams (IFTs) as well as cost, volume and yield targets. Preserving the decades-long trend of 30% per year reduction in cost per function also requires capturing all possible cost reduction opportunities. These include opportunities in front-end as well as back-end production, facilities, yield management and improvement, increased system integration such as up and down the supply chain, and improving environmental health and safety. FI challenges play a key role realizing these opportunities and many FI technology challenges are becoming limiters to achieving major technology milestones.
{"title":"Factory Integration","authors":"Supika Mashiro, J. Moyne","doi":"10.1109/irds54852.2021.00016","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00016","url":null,"abstract":"The Factory Integration (FI) chapter of the IRDS is dedicated to ensuring that the microelectronics manufacturing infrastructure contains the necessary components to produce items at affordable cost and high volume. Realizing the potential of Moore's Law requires taking full advantage of device feature size reductions, new materials, yield improvement to near 100%, wafer size increases, and other manufacturing productivity improvements. This in turn requires a factory system that can fully integrate additional factory components and utilize these components collectively to deliver items that meet specifications determined by other IRDS international focus teams (IFTs) as well as cost, volume and yield targets. Preserving the decades-long trend of 30% per year reduction in cost per function also requires capturing all possible cost reduction opportunities. These include opportunities in front-end as well as back-end production, facilities, yield management and improvement, increased system integration such as up and down the supply chain, and improving environmental health and safety. FI challenges play a key role realizing these opportunities and many FI technology challenges are becoming limiters to achieving major technology milestones.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125301752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00006
{"title":"2021 IRDS Teams' Acknowledgments","authors":"","doi":"10.1109/irds54852.2021.00006","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00006","url":null,"abstract":"","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"157 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115288240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00012
D. Holmes
The goal of this International Roadmap for Devices and Systems (IRDS) chapter is to survey, catalog, and assess the status of technologies in the areas of cryogenic electronics and quantum information processing. Application drivers are identified for sufficiently developed technologies and application needs are mapped as a function of time against projected capabilities to identify challenges requiring research and development effort.
{"title":"Cryogenic Electronics And Quantum Information Processing","authors":"D. Holmes","doi":"10.1109/irds54852.2021.00012","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00012","url":null,"abstract":"The goal of this International Roadmap for Devices and Systems (IRDS) chapter is to survey, catalog, and assess the status of technologies in the areas of cryogenic electronics and quantum information processing. Application drivers are identified for sufficiently developed technologies and application needs are mapped as a function of time against projected capabilities to identify challenges requiring research and development effort.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131324482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00004
{"title":"What is the IRDS?","authors":"","doi":"10.1109/irds54852.2021.00004","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00004","url":null,"abstract":"","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"151 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115120130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00010
M. Badaroglu
System scaling enabled by Moore's scaling is increasingly challenged by the scarcity of resources such as power and interconnect bandwidth. This has become more challenging under the requirements of seamless interaction between big data and instant data (Figure MM-1). Instant data generation requires ultra-low-power devices with an “always-on” feature at the same time with high-performance devices that can generate the data instantly. Big data requires abundant computing, communication bandwidth, and memory resources to generate the service and information that clients need.
{"title":"More Moore","authors":"M. Badaroglu","doi":"10.1109/irds54852.2021.00010","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00010","url":null,"abstract":"System scaling enabled by Moore's scaling is increasingly challenged by the scarcity of resources such as power and interconnect bandwidth. This has become more challenging under the requirements of seamless interaction between big data and instant data (Figure MM-1). Instant data generation requires ultra-low-power devices with an “always-on” feature at the same time with high-performance devices that can generate the data instantly. Big data requires abundant computing, communication bandwidth, and memory resources to generate the service and information that clients need.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129103361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00008
T. Conte
The mission of the Applications Benchmarking11Note that in the computer industry, as opposed to the larger semiconductor industry, “benchmarking” refers to using test programs that serve as proxies for user applications in order to estimate the performance of a computer system on a given application domain. (AB) International Focus Team (IFT) is to identify key application drivers, and to track and roadmap the performance of these applications for the next 15 years. Given a list of market drivers from the Systems and Architectures International Focus Team (SA IFT), AB generates a cross matrix map showing which application(s) are important or critical (gating) for each market.
{"title":"Application Benchmarking","authors":"T. Conte","doi":"10.1109/irds54852.2021.00008","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00008","url":null,"abstract":"The mission of the Applications Benchmarking11Note that in the computer industry, as opposed to the larger semiconductor industry, “benchmarking” refers to using test programs that serve as proxies for user applications in order to estimate the performance of a computer system on a given application domain. (AB) International Focus Team (IFT) is to identify key application drivers, and to track and roadmap the performance of these applications for the next 15 years. Given a list of market drivers from the Systems and Architectures International Focus Team (SA IFT), AB generates a cross matrix map showing which application(s) are important or critical (gating) for each market.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129520279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00015
Devaryan Gupta
Packaging Integration (PI) refers to the integration of separately manufactured components into a higher-level assembly that in the aggregate provides enhanced functionality and improved operating characteristics.
{"title":"Packaging Integration White Paper","authors":"Devaryan Gupta","doi":"10.1109/irds54852.2021.00015","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00015","url":null,"abstract":"Packaging Integration (PI) refers to the integration of separately manufactured components into a higher-level assembly that in the aggregate provides enhanced functionality and improved operating characteristics.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116068411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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