Standardization of test structure design

C. Weber
{"title":"Standardization of test structure design","authors":"C. Weber","doi":"10.1109/ICMTS.1990.161730","DOIUrl":null,"url":null,"abstract":"A plan for standardization of test structure design based on a high-level information model is presented. The plan's implementation has dramatically improved the productivity of test chip layout, test software generation, data analysis, and documentation. Design errors, parametric test software defects, and documentation defects have been reduced to negligible levels.<<ETX>>","PeriodicalId":417292,"journal":{"name":"Proceedings of the 1991 International Conference on Microelectronic Test Structures","volume":"91 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 1991 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1990.161730","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

A plan for standardization of test structure design based on a high-level information model is presented. The plan's implementation has dramatically improved the productivity of test chip layout, test software generation, data analysis, and documentation. Design errors, parametric test software defects, and documentation defects have been reduced to negligible levels.<>
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标准化测试结构设计
提出了一种基于高级信息模型的测试结构设计标准化方案。该计划的实施极大地提高了测试芯片布局、测试软件生成、数据分析和文档的生产率。设计错误、参数化测试软件缺陷和文档缺陷已经减少到可以忽略不计的程度
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