Analysis and comparison of the CV-Dispersion of high-k, bi-layered MOS InGaAs/InP stacks

S. Pazos, F. Palumbo, F. Aguirre
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Abstract

In this work, the origin of the C-V dispersion in accumulation on High-k Bi-layered InGaAs and InP substrate MOS capacitors is discussed. Using different proportions of Al2O3 and HfO2 dielectrics on a 10nm thick gate insulator, the influence of each layer and its defects is studied. Results show that increasing the thickness of the Al2O3 interfacial layer contributes to improve the quality of the structure in terms of border trap density. InP based stacks show the same tendencies of InGaAs based stacks, but with a higher overall dispersion attributed to the quality of the dielectric deposition on different substrates.
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高k双层MOS InGaAs/InP堆叠的cv -色散分析与比较
本文讨论了高钾双层InGaAs和InP衬底MOS电容器上积累的C-V色散的来源。在10nm厚栅极绝缘子上采用不同比例的Al2O3和HfO2介电材料,研究了各层的影响及其缺陷。结果表明,增加Al2O3界面层厚度有助于提高边界陷阱密度的结构质量。InP基堆叠表现出与InGaAs基堆叠相同的趋势,但由于不同衬底上的介电沉积质量,其总体色散更高。
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