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2017 1st Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA)最新文献

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Design of a delayless feedback path free 2nd-order two-path time-interleaved discrete-time delta-sigma modulator- a new approach 一种无延迟反馈路径的二阶时间交错离散δ - σ调制器设计新方法
J. Talebzadeh, I. Kale
This paper presents the design procedure for a 2nd_order two-path Discrete-Time Time-Interleaved (DTTI) ΔΣ modulator from a conventional single-loop 2nd-order Discrete-Time (DT) ΔΣ modulator through the use of time domain equations and time-interleaving concepts [1]. The resulting modulator is free from the delayless feedback path and has only one set of integrators. The delayless feedback path issue in Time-Interleaved (TI) ΔΣ modulators is a critical restriction for the implementation of TI ΔΣ modulators and is effectively eliminated through the use of the approach proposed in this paper. The DTTI ΔΣ modulator requires only three op-amps and two quantizers both of which work concurrently, in comparison to the single-loop DT counterpart that also deploys two op-amps. For an OverSampling Ratio (OSR) of 16 and a clock frequency of 640MHz, our simulation results show a maximum Signal-to-Noise Ratio (SNR) for the DTTI ΔΣ modulator to be 70.5dB with an input bandwidth of 20MHz which has 15dB improvement in comparison to its single-loop, single-path DT counterpart.
本文通过使用时域方程和时间交错概念[1],介绍了从传统的单回路二阶离散时间(DT) ΔΣ调制器到二阶双路径离散时间交错(DTTI) ΔΣ调制器的设计过程。所得到的调制器不受无延迟反馈路径的影响,并且只有一组积分器。时间交错(TI) ΔΣ调制器中的无延迟反馈路径问题是实现TI ΔΣ调制器的一个关键限制,通过使用本文提出的方法可以有效地消除。DTTI ΔΣ调制器只需要三个运算放大器和两个量化器同时工作,而单回路DT调制器也需要部署两个运算放大器。在过采样比(OSR)为16、时钟频率为640MHz的情况下,我们的仿真结果显示,DTTI ΔΣ调制器在输入带宽为20MHz时的最大信噪比(SNR)为70.5dB,与单环单路DT调制器相比,提高了15dB。
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引用次数: 0
A 280μW sub-threshold Balun LNA for medical radio using current re-use technique 基于电流复用技术的280μW亚阈值Balun LNA
K. V. Reddy, S. K., P. H
A 280 μW current-reuse, sub-threshold balun low noise amplifier (LNA) is presented for medical radio device communication (MedRadio) over the frequency range of 401- 406 MHz. An exemplary balun LNA is designed in a UMC 0.18- μm CMOS technology. The differential conversion of RF input has been procured by stacking power phase splitter (PPS) on top of the inductively degenerated common-source (IDCS) technique. The proposed balun LNA accomplish voltage gain of 19 dB, input & output isolation is less than -14 dB, noise figure of 4.1 dB and IIP3 of -15dBm while consuming 280 μA from 1V supply. The gain & phase error between differential outputs is 1 dB & 0.60 respectively. The layout area of proposed balun LNA core is 0.988mm2.
提出了一种用于医疗无线电设备通信(MedRadio)的280 μW电流复用、亚阈值平衡低噪声放大器(LNA),频率范围为401 ~ 406 MHz。采用UMC 0.18 μm CMOS技术设计了一种典型的平衡LNA。利用功率分相器(PPS)叠加在电感退化共源(IDCS)技术之上,实现了射频输入的差分转换。该平衡电路在1V电源消耗280 μA的情况下,电压增益为19 dB,输入输出隔离小于-14 dB,噪声系数为4.1 dB, IIP3为-15dBm。差分输出之间的增益和相位误差分别为1 dB和0.60。所提出的平衡LNA核心布局面积为0.988mm2。
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引用次数: 4
Analysis and comparison of the CV-Dispersion of high-k, bi-layered MOS InGaAs/InP stacks 高k双层MOS InGaAs/InP堆叠的cv -色散分析与比较
S. Pazos, F. Palumbo, F. Aguirre
In this work, the origin of the C-V dispersion in accumulation on High-k Bi-layered InGaAs and InP substrate MOS capacitors is discussed. Using different proportions of Al2O3 and HfO2 dielectrics on a 10nm thick gate insulator, the influence of each layer and its defects is studied. Results show that increasing the thickness of the Al2O3 interfacial layer contributes to improve the quality of the structure in terms of border trap density. InP based stacks show the same tendencies of InGaAs based stacks, but with a higher overall dispersion attributed to the quality of the dielectric deposition on different substrates.
本文讨论了高钾双层InGaAs和InP衬底MOS电容器上积累的C-V色散的来源。在10nm厚栅极绝缘子上采用不同比例的Al2O3和HfO2介电材料,研究了各层的影响及其缺陷。结果表明,增加Al2O3界面层厚度有助于提高边界陷阱密度的结构质量。InP基堆叠表现出与InGaAs基堆叠相同的趋势,但由于不同衬底上的介电沉积质量,其总体色散更高。
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引用次数: 0
Experimental study of progressive breakdown in different conductance states of resistive switching structures 电阻开关结构不同电导状态下递进击穿的实验研究
F. Aguirre, S. Pazos, F. Palumbo
In this work, the breakdown transients of Al2O3- and HfO2-based metal-insulator-metal (MIM) stacks with the same oxide thickness and identical metal electrodes are studied. The differences and similarities between these transients in the progressive breakdown regime are assessed. Results show that Al2O3 exhibits longer breakdown transients than HfO2 and requires a higher voltage to initiate a very fast current runaway across the dielectric film. Similar results are observed when the devices are in remarkably different conductive states reached as a consequence of a resistive switching event. This suggests that both resistive switching and breakdown processes are linked to the thermal properties of the oxides under test rather than to dissipation effects occurring at the metal electrodes.
本文研究了具有相同氧化物厚度和相同金属电极的Al2O3-和hfo2 -金属-绝缘体-金属(MIM)叠层的击穿瞬态。评估了这些瞬态在渐进式击穿体系中的异同。结果表明,Al2O3具有比HfO2更长的击穿瞬态,并且需要更高的电压才能在介电膜上引发快速的电流失控。当器件处于由于电阻开关事件而达到的显著不同的导电状态时,观察到类似的结果。这表明电阻开关和击穿过程都与被测氧化物的热性能有关,而不是与金属电极上发生的耗散效应有关。
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引用次数: 0
Programmable assertion checkers for hardware Trojan detection 可编程的断言检查硬件木马检测
Uthman Alsaiari, F. Gebali, M. Abd-El-Barr
Due to the increase in design complexity and cost of VLSI chips, a number of design houses outsource manufacturing and import designs in a way to reduce the cost. This results in a decrease of the authenticity and security of the manufactured product. Since product development involves outside sources, circuit designers can not guarantee that their hardware has not been altered. It is often possible that attackers include additional hardware in order to gain privileges over the original circuit or cause damage to the product. These added circuits are called “Hardware Trojans”. In this paper, we investigate introducing necessary modules needed for detection of hardware Trojans. We also introduce necessary programmable logic fabric that can be used in the implementation of the hardware assertion checkers. Our target is to utilize the provided programable fabric in a System on Chip (SoC) and optimize the hardware assertion to cover the detection of most hardware trojans in each core of the target SoC.
由于VLSI芯片的设计复杂性和成本的增加,许多设计公司将制造外包并进口设计以降低成本。这导致了制造产品的真实性和安全性的降低。由于产品开发涉及外部资源,电路设计者不能保证他们的硬件没有被改变。攻击者通常可能包括额外的硬件,以获得对原始电路的特权或对产品造成损害。这些增加的电路被称为“硬件木马”。本文主要介绍了硬件木马检测所需的模块。我们还介绍了必要的可编程逻辑结构,可用于硬件断言检查器的实现。我们的目标是利用片上系统(SoC)中提供的可编程结构,并优化硬件断言,以覆盖目标SoC每个核心中的大多数硬件木马的检测。
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引用次数: 3
Grid-voltage sensorless control of an LCL filter with low resonance frequency 低谐振频率LCL滤波器的无电网电压传感器控制
R. Fantino, C. Busada, J. Solsona
A Grid-Voltage sensorless control strategy for LCL Grid-connected voltage source inverters is proposed. Positive and negative grid sequences used for synchronization are estimated using an observer. The control of the system is implemented with a strategy that allows the use of the proportional plus resonant regulator (PR) optimum design, regardless of the filter resonance frequency. The effectiveness of the proposal is demonstrated by simulation in a realistic scenario.
提出了一种LCL并网电压源逆变器的无电压传感器控制策略。使用观测器估计用于同步的正、负网格序列。系统的控制是通过一种策略来实现的,该策略允许使用比例加谐振调节器(PR)优化设计,而不考虑滤波器的谐振频率。通过一个实际场景的仿真验证了该方案的有效性。
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引用次数: 1
AES block cipher implementations with AMBA-AHB interface AES分组密码实现与AMBA-AHB接口
Paola Ceminari, Ariel Arelovich, M. D. Federico
The aim of this work is to describe three different architectural designs for AES cipher, which is a symmetric block encryption standard. The three architectures are oriented to different applications and are designed using different approaches, like pipeline structures and resource sharing. They also include an AMBA AHB interface, which is an open standard that defines the interconnection of blocks in a System-on-Chip (SoC).
本文的目的是描述AES密码的三种不同的体系结构设计,AES是一种对称块加密标准。这三种体系结构面向不同的应用程序,使用不同的方法进行设计,比如管道结构和资源共享。它们还包括一个AMBA AHB接口,这是一个开放标准,定义了片上系统(SoC)中块的互连。
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引用次数: 3
HDL and design techniques analysis for FPGA & ASIC synthesis FPGA与ASIC合成的HDL与设计技术分析
Paola Ceminari, Ariel Oroz De Gaetano, Jorge Bellini, M. D. Federico
This work presents the design of a Morse decoder implemented using fourteen different architectures described in Verilog. All designs are synthesized in FPGA and ASIC, using Xilinx ISE and Vivado for the former and Leonardo Spectrum and Design Compiler for the latter. The performance and resource requirements after synthesis of each architecture are compared to gain insight on the impact caused by using different design styles, description techniques, architectural variants and the circuit’s final target.
这项工作介绍了使用Verilog中描述的14种不同架构实现的莫尔斯解码器的设计。所有设计均在FPGA和ASIC中合成,前者使用Xilinx ISE和Vivado,后者使用Leonardo Spectrum和Design Compiler。综合每个架构后的性能和资源需求进行比较,以深入了解使用不同的设计风格,描述技术,架构变体和电路的最终目标所造成的影响。
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引用次数: 0
Synthesis and design of a 4th order low-pass DT sigma-delta modulator in a 130nm cmos process 四阶低通DT σ - δ调制器的合成与设计
D. Calderón-Preciado, F. Sandoval-Ibarra, F. Silveira
This paper summarizes the research work carried out during a doctorate studies, which is focused on the synthesis and design of a 4th Order ΣΔ Modulator in Discrete Time (DT) implemented in a 130nm CMOS process. By means of SIMSIDES the high-level simulation of the modulator is analyzed in order to translate the design specifications into a set of values such that the transistor level blocks be established by the desired performance of the proposed architecture. At the transistor level design, special attention is focused to the OTA, since this block is the main source of non-idealities in a Switched Capacitor (SC) Integrator. Moreover, the gm/ID methodology is implemented into this stage as a tool to obtain the optimum circuit performance based on power consumption and better signal-to-noise ratio.
本文总结了博士学习期间的研究工作,重点是在130nm CMOS工艺中实现的4阶离散时间(DT)调制器的合成和设计。通过SIMSIDES对调制器的高级仿真进行分析,以便将设计规范转化为一组值,从而根据所提出的体系结构的期望性能建立晶体管电平块。在晶体管级设计中,需要特别注意OTA,因为该模块是开关电容(SC)集成器中非理想的主要来源。此外,gm/ID方法被实现到这一阶段,作为基于功耗和更好的信噪比获得最佳电路性能的工具。
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引用次数: 2
Robustness evaluation of finFET transistors under PVT variability PVT变异性下finFET晶体管鲁棒性评价
A. Zimpeck, C. Meinhardt, R. Reis
This work provides a predictive evaluation of the impact that PVT variability causes on ON and OFF currents of FinFET transistors in technologies sub-22nm. Results show that the OFF current is the most impacted by all sources of variability. In terms of process variability effects, the LG and WFF variations cause the worst values to IOFF, especially for PFET and NFET devices, respectively. Voltage and temperature variations effects damage more the PFET devices.
这项工作为PVT可变性对22nm以下技术的FinFET晶体管的on和OFF电流的影响提供了预测评估。结果表明,OFF电流受所有变异性源的影响最大。就工艺可变性效应而言,LG和WFF的变化对IOFF的影响最大,尤其是对pet和NFET器件。电压和温度的变化对pet器件的破坏更大。
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引用次数: 1
期刊
2017 1st Conference on PhD Research in Microelectronics and Electronics Latin America (PRIME-LA)
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