Wai Pan Chan, Arup K. George, M. Narducci, D. D. Cheam, S. C. Leong, M. Tsai, A. A. Rahman, M. K. Park, Z. Kong, J. Rao, Yuan Gao, M. Je
{"title":"A pressure/oxygen/temperature sensing SoC for multimodality intracranial neuromonitoring","authors":"Wai Pan Chan, Arup K. George, M. Narducci, D. D. Cheam, S. C. Leong, M. Tsai, A. A. Rahman, M. K. Park, Z. Kong, J. Rao, Yuan Gao, M. Je","doi":"10.1109/ASSCC.2013.6690989","DOIUrl":null,"url":null,"abstract":"A fully integrated SoC for multimodality intracranial neuromonitoring is presented. This SoC includes a capacitive MEMS pressure sensor, an electrochemical oxygen sensor, a solid-state temperature sensor and sensor interface circuits in a single chip. Chopper stabilization and dynamic element matching techniques are applied in sensor interface circuits to reduce circuit noise and offset. On-chip calibration is implemented for each sensor to compensate process variations. Measured accuracies of the pressure, oxygen, and temperature sensors are ±1 mmHg, ±1 mmHg, and ±0.2 oC, respectively. Implemented in 0.18-μm CMOS, the SoC occupies an area of 1.4 mm × 4mm and consumes 188-μW DC power.","PeriodicalId":296544,"journal":{"name":"2013 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"178 12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE Asian Solid-State Circuits Conference (A-SSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASSCC.2013.6690989","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
A fully integrated SoC for multimodality intracranial neuromonitoring is presented. This SoC includes a capacitive MEMS pressure sensor, an electrochemical oxygen sensor, a solid-state temperature sensor and sensor interface circuits in a single chip. Chopper stabilization and dynamic element matching techniques are applied in sensor interface circuits to reduce circuit noise and offset. On-chip calibration is implemented for each sensor to compensate process variations. Measured accuracies of the pressure, oxygen, and temperature sensors are ±1 mmHg, ±1 mmHg, and ±0.2 oC, respectively. Implemented in 0.18-μm CMOS, the SoC occupies an area of 1.4 mm × 4mm and consumes 188-μW DC power.