Jenn-Ming Song, Sin-Yong Liang, Po-Hao Chiang, Shang-Kun Huang, Y. Chiu, D. Tarng, C. Hung
{"title":"Effects of electromagnetic radiation exposure on direct Cu bonding","authors":"Jenn-Ming Song, Sin-Yong Liang, Po-Hao Chiang, Shang-Kun Huang, Y. Chiu, D. Tarng, C. Hung","doi":"10.23919/LTB-3D.2017.7947439","DOIUrl":null,"url":null,"abstract":"An innovative pre-treatment to enhance Cu-to-Cu bonding through the exposure of electromagnetic radiations including flash light and near infrared rays is first proposed in this study. Short period of electromagnetic radiation exposure can significantly improve the bonding strength. It can be ascribed to the sudden heating/cooling and thus compressive residual stresses which enhance the diffusion of copper atoms and direct bonding.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947439","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
An innovative pre-treatment to enhance Cu-to-Cu bonding through the exposure of electromagnetic radiations including flash light and near infrared rays is first proposed in this study. Short period of electromagnetic radiation exposure can significantly improve the bonding strength. It can be ascribed to the sudden heating/cooling and thus compressive residual stresses which enhance the diffusion of copper atoms and direct bonding.
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