Hirotatsu Ikarashi, Toshiyuki Sato, S. Teraki, Masaki Yoshida, H. Ozaki
{"title":"Low Dk / Df Dielectric Material for 5G Applications","authors":"Hirotatsu Ikarashi, Toshiyuki Sato, S. Teraki, Masaki Yoshida, H. Ozaki","doi":"10.23919/ICEP55381.2022.9795630","DOIUrl":null,"url":null,"abstract":"In this paper, we have developed a new low Dk / Df dielectric material for 5G applications. This material is based on modified polyphenylene ether (m-PPE) and elastomer. It can be cured at 200 degrees Celsius. This material has low Dk / Df, high Tg, low water absorption and low warpage properties, therefore it is suitable dielectric layers for 5G Wafer Level Chip Size Packages (WL-CSP) and High-Performance Computing (HPC) substrates.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795630","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
In this paper, we have developed a new low Dk / Df dielectric material for 5G applications. This material is based on modified polyphenylene ether (m-PPE) and elastomer. It can be cured at 200 degrees Celsius. This material has low Dk / Df, high Tg, low water absorption and low warpage properties, therefore it is suitable dielectric layers for 5G Wafer Level Chip Size Packages (WL-CSP) and High-Performance Computing (HPC) substrates.
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