Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795414
Yoichi Maruo, D. Hashimoto, M. Kiso, Katsuhisa Tanabe, Yukinori Oda, S. Hashimoto
The electrolytic multi plating method (EMPM) of Bi and Sn was studied as the approach that supplied Sn-Bi solder. Ni/Bi/Sn and Cu/Bi/Sn coupon were prepared to compare the influence of the different under layer for Bi dispersion. And then, these coupons were jointed under 170 or 190 oC with the coupon which plated electrolytic Sn-Ag. When it’s jointed under 190 oC, uniform Bi dispersion in the solder was confirmed for the coupon by multi plating method from SEM observation and EDS analysis, which was similar to one by solder paste method[1]-[2]. Also, after the heat soak test under 100 oC for 500 hours, Bi aggregation and some cracks were observed in the solder near the Ni deposit for the coupon of Ni/Bi/Sn. On the other hand, Bi was dispersed to the center of the solder for the coupon of Cu/Bi/Sn and no cracks were observed.
{"title":"Solder/solder joint for low temperature reflow by multi plating method","authors":"Yoichi Maruo, D. Hashimoto, M. Kiso, Katsuhisa Tanabe, Yukinori Oda, S. Hashimoto","doi":"10.23919/ICEP55381.2022.9795414","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795414","url":null,"abstract":"The electrolytic multi plating method (EMPM) of Bi and Sn was studied as the approach that supplied Sn-Bi solder. Ni/Bi/Sn and Cu/Bi/Sn coupon were prepared to compare the influence of the different under layer for Bi dispersion. And then, these coupons were jointed under 170 or 190 oC with the coupon which plated electrolytic Sn-Ag. When it’s jointed under 190 oC, uniform Bi dispersion in the solder was confirmed for the coupon by multi plating method from SEM observation and EDS analysis, which was similar to one by solder paste method[1]-[2]. Also, after the heat soak test under 100 oC for 500 hours, Bi aggregation and some cracks were observed in the solder near the Ni deposit for the coupon of Ni/Bi/Sn. On the other hand, Bi was dispersed to the center of the solder for the coupon of Cu/Bi/Sn and no cracks were observed.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"117 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115639631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795597
HongWen Zhang, S. Lim, Samuel Lytwynec, Tyler Richmond, Tybarius Harter
Indium Corporation has designed two Sn-based high-temperature lead-free (HTLF) solder pastes, which combine the merits of two constituent powders, to be used as drop-in solutions to replace high-Pb solder pastes in power discrete applications. Solder paste HTLF-1 maintained bond shear strength up to 15MPa, even around 290°C. Another solder paste, HTLF-2, had a similar bond shear strength as Pb92.5/Sn5/Ag2.5 around 290°C, but exceeded substantially below 250°C. The encapsulated components were built with both HTLF solder pastes through the traditional high-Pb process, demonstrating the drop-in processing compatibility. Those components have passed both moisture sensitivity level 1 (MSL-1) and TCT (-55/175°C). Both HTLF solder pastes outperformed Pb92.5/Sn5/Ag2.5 in RDS(on) before and after 1000cycles TCT (-55/175°C), which is attributed to the intrinsic lower electrical resistivity of Sn.
{"title":"A Drop-In High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications","authors":"HongWen Zhang, S. Lim, Samuel Lytwynec, Tyler Richmond, Tybarius Harter","doi":"10.23919/ICEP55381.2022.9795597","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795597","url":null,"abstract":"Indium Corporation has designed two Sn-based high-temperature lead-free (HTLF) solder pastes, which combine the merits of two constituent powders, to be used as drop-in solutions to replace high-Pb solder pastes in power discrete applications. Solder paste HTLF-1 maintained bond shear strength up to 15MPa, even around 290°C. Another solder paste, HTLF-2, had a similar bond shear strength as Pb92.5/Sn5/Ag2.5 around 290°C, but exceeded substantially below 250°C. The encapsulated components were built with both HTLF solder pastes through the traditional high-Pb process, demonstrating the drop-in processing compatibility. Those components have passed both moisture sensitivity level 1 (MSL-1) and TCT (-55/175°C). Both HTLF solder pastes outperformed Pb92.5/Sn5/Ag2.5 in RDS(on) before and after 1000cycles TCT (-55/175°C), which is attributed to the intrinsic lower electrical resistivity of Sn.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117144128","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795523
Zheng Zhang, A. Suetake, Chuantong Chen, O. Katayama, H. Ishino, Takeshi Endo, K. Sugiura, K. Tsuruta, K. Suganuma
In this work, we assembled thermal cycling equipment by a halogen lamp heater and applied the acoustic emission (AE) technique to real-time monitor and diagnose the health state of die attach structures used in power electronics. The assembled equipment is able to execute a cycling environment with a temperature variation from room temperature to 165 °C. Meanwhile, AE monitoring can be applied at the same time to real-time diagnose the health condition of a die attach structure. A soldered die attach structure was tested by 10000 cycles on this platform. AE signals were acquired during the cycling test, which originated from solder layer cracks that were confirmed by scanning acoustic tomography observations. This platform shows a superior specialty in detecting cracking of solder layer due to the high sensitivity of AE monitoring. Meanwhile, the cumulative AE counts that indicate the degree of cracking can be an important indication for diagnosing the health condition of the die attach structure.
{"title":"Real-time monitoring and diagnosis of die attach structure deterioration by using acoustic emission method","authors":"Zheng Zhang, A. Suetake, Chuantong Chen, O. Katayama, H. Ishino, Takeshi Endo, K. Sugiura, K. Tsuruta, K. Suganuma","doi":"10.23919/ICEP55381.2022.9795523","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795523","url":null,"abstract":"In this work, we assembled thermal cycling equipment by a halogen lamp heater and applied the acoustic emission (AE) technique to real-time monitor and diagnose the health state of die attach structures used in power electronics. The assembled equipment is able to execute a cycling environment with a temperature variation from room temperature to 165 °C. Meanwhile, AE monitoring can be applied at the same time to real-time diagnose the health condition of a die attach structure. A soldered die attach structure was tested by 10000 cycles on this platform. AE signals were acquired during the cycling test, which originated from solder layer cracks that were confirmed by scanning acoustic tomography observations. This platform shows a superior specialty in detecting cracking of solder layer due to the high sensitivity of AE monitoring. Meanwhile, the cumulative AE counts that indicate the degree of cracking can be an important indication for diagnosing the health condition of the die attach structure.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116188489","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795428
Cheong-Ha Jung, Jung-Rae Park, S. Seo, Eunsol Jo, Gu-sung Kim
HBM(High Bandwidth Memory) is stacked structure of 2.5D. As many materials are combined to form a structure, various problems occur. In HBM, which is sensitive to communication speed, delay due to loss becomes a major issue. Therefore DOE(Design of Experiment) was performed by controlling the diameter and depth of TSV in the HBM structure using HFSS EM(Electromagnetic) solver. In the case of return loss, it is judged that the diameter of the TSV has no significant effect compared to the depth. In the case of insertion loss, the insertion loss increases as the diameter of the TSV increases, but on the contrary, the insertion loss tends to decrease as the depth of the TSV increases.
{"title":"A study of electromigration effect according to interposer area effect","authors":"Cheong-Ha Jung, Jung-Rae Park, S. Seo, Eunsol Jo, Gu-sung Kim","doi":"10.23919/ICEP55381.2022.9795428","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795428","url":null,"abstract":"HBM(High Bandwidth Memory) is stacked structure of 2.5D. As many materials are combined to form a structure, various problems occur. In HBM, which is sensitive to communication speed, delay due to loss becomes a major issue. Therefore DOE(Design of Experiment) was performed by controlling the diameter and depth of TSV in the HBM structure using HFSS EM(Electromagnetic) solver. In the case of return loss, it is judged that the diameter of the TSV has no significant effect compared to the depth. In the case of insertion loss, the insertion loss increases as the diameter of the TSV increases, but on the contrary, the insertion loss tends to decrease as the depth of the TSV increases.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129887258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795437
J. Bickel, M. Schneider-Ramelow, K.-D. Lang, R. Gesche, H. Ngo
For the atmospheric pressure sputtering technology, directly structured thin- and highly conductive layers of platinum were additively deposited on Al2O3 ceramic substrate. The necessary process parameters could be identified and the layers could be contacted by using thin-wire bonding. A subsequent storage for 10 h at 500 °C shows no degeneration of the mechanical bonding properties.
{"title":"Platinum interconnections for harsh environment applications using atmospheric pressure sputtering","authors":"J. Bickel, M. Schneider-Ramelow, K.-D. Lang, R. Gesche, H. Ngo","doi":"10.23919/ICEP55381.2022.9795437","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795437","url":null,"abstract":"For the atmospheric pressure sputtering technology, directly structured thin- and highly conductive layers of platinum were additively deposited on Al2O3 ceramic substrate. The necessary process parameters could be identified and the layers could be contacted by using thin-wire bonding. A subsequent storage for 10 h at 500 °C shows no degeneration of the mechanical bonding properties.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116235595","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795393
Li Wern Chew, C. Y. Tan, Ming Dak Chai, Yun Rou Lim
Signal integrity (SI) performance is very much dependent on the cleanliness of a channel design in terms of impedance matching, insertion loss, reflection noise and signaling return path. This paper summarizes the layout optimization study done on USB3.2 Gen2 (10Gbps) signaling, which includes our proposal on via stub design, connector routing entry layer, placement of ground via stitching as well as component pad voiding size. Significant improvement in signaling eye margin is observed with the proposed channel optimization techniques. With the improved channel design, USB3.2 Gen2 is expected to be able to support longer routing length from the chip to its connector without the needs of adding a repeater. This will in turn provides cost saving to a computing platform design.
{"title":"PCB Channel Optimization Techniques for High-Speed Differential Interconnects","authors":"Li Wern Chew, C. Y. Tan, Ming Dak Chai, Yun Rou Lim","doi":"10.23919/ICEP55381.2022.9795393","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795393","url":null,"abstract":"Signal integrity (SI) performance is very much dependent on the cleanliness of a channel design in terms of impedance matching, insertion loss, reflection noise and signaling return path. This paper summarizes the layout optimization study done on USB3.2 Gen2 (10Gbps) signaling, which includes our proposal on via stub design, connector routing entry layer, placement of ground via stitching as well as component pad voiding size. Significant improvement in signaling eye margin is observed with the proposed channel optimization techniques. With the improved channel design, USB3.2 Gen2 is expected to be able to support longer routing length from the chip to its connector without the needs of adding a repeater. This will in turn provides cost saving to a computing platform design.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"415 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117294577","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795614
K. Kishimoto, S. Shoji, J. Mizuno
In this study, we have successfully fabricated a novel biomaterial polymer, possessing a 3D microarchitecture, with a simple and inexpensive manufacturing process. This biomaterial is a polydimethylsiloxane (PDMS) and poly(ether) ether ketone (PEEK) composites, which possesses highly porous structure, mimicking the mechanical and heterogeneous properties of the human body. For biocompatible approaches, a thin film of TiO2 was deposited on the surface of the polymer using atomic layer deposition (ALD). Based on scanning electron microscopy analysis, universal tensile testing and x-ray photoelectron spectroscopy analysis, it was confirmed that this novel biomaterial has a high potential of becoming a spinal implant material in the future.
{"title":"Development of a Novel Biomaterial for Spinal Implant Purpose","authors":"K. Kishimoto, S. Shoji, J. Mizuno","doi":"10.23919/ICEP55381.2022.9795614","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795614","url":null,"abstract":"In this study, we have successfully fabricated a novel biomaterial polymer, possessing a 3D microarchitecture, with a simple and inexpensive manufacturing process. This biomaterial is a polydimethylsiloxane (PDMS) and poly(ether) ether ketone (PEEK) composites, which possesses highly porous structure, mimicking the mechanical and heterogeneous properties of the human body. For biocompatible approaches, a thin film of TiO2 was deposited on the surface of the polymer using atomic layer deposition (ALD). Based on scanning electron microscopy analysis, universal tensile testing and x-ray photoelectron spectroscopy analysis, it was confirmed that this novel biomaterial has a high potential of becoming a spinal implant material in the future.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128867141","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795463
H. Iwanaga
established molecular design concept of Eu(III) complexes for increasing photoluminescence intensity and solubility in polymers and solvents. Several dozens of Eu(III) complexes according to this concept were synthesized and their photoluminescence properties were investigated. Coordinating asymmetric diphosphine dioxide ligand to a Eu(III) ion found to be significantly effective for improving photoluminescence properties of Eu(III) complexes. Colorless and transparent materials involving these Eu(III) complexes are promising candidates for LED devices, security, and sensing.
{"title":"Photoluminescence Properties of Eu(III) Complexes with an Asymmetric Diphosphine Dioxide Ligand for Potential Uses in LED, Security, and Sensing Devices","authors":"H. Iwanaga","doi":"10.23919/ICEP55381.2022.9795463","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795463","url":null,"abstract":"established molecular design concept of Eu(III) complexes for increasing photoluminescence intensity and solubility in polymers and solvents. Several dozens of Eu(III) complexes according to this concept were synthesized and their photoluminescence properties were investigated. Coordinating asymmetric diphosphine dioxide ligand to a Eu(III) ion found to be significantly effective for improving photoluminescence properties of Eu(III) complexes. Colorless and transparent materials involving these Eu(III) complexes are promising candidates for LED devices, security, and sensing.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115921028","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795567
Kota Tokuda, Keiko Kaji, Kiyokazu Ishizaki
As a consequence of the increase in data storage capacity on hard disk drives(HDDs), there is a growing need for high-density mounting technologies for printed circuit boards(PCBs) installed in them. In particular, flexible printed circuit boards(FPCs) incorporated in HDDs are facing critical issues including not only severe external restrictions but also the difficulty of mounting preamplifier integrated circuits(ICs) due to the increase in the number of pins and the size of packages. From the standpoints of both quality and productivity in HDD manufacturing, it is therefore necessary to optimize the specifications of FPCs from the conceptual design phase. We have been taking the initiative in developing high-density PCB mounting technologies. We are promoting determination of the specifications of key parts at the initial stage of the design phase and optimization of design in consideration of manufacturing quality, mounting process, and reliability, as well as reliability verification tests. These efforts are making a major contribution to the realization of high-density, high-reliability PCBs suitable. In this report, the process of design and the key technology of high-density mounting have been described.
{"title":"High-Density Mounting Technologies for Printed Circuit Boards in Large-Capacity 3.5-inch HDDs","authors":"Kota Tokuda, Keiko Kaji, Kiyokazu Ishizaki","doi":"10.23919/ICEP55381.2022.9795567","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795567","url":null,"abstract":"As a consequence of the increase in data storage capacity on hard disk drives(HDDs), there is a growing need for high-density mounting technologies for printed circuit boards(PCBs) installed in them. In particular, flexible printed circuit boards(FPCs) incorporated in HDDs are facing critical issues including not only severe external restrictions but also the difficulty of mounting preamplifier integrated circuits(ICs) due to the increase in the number of pins and the size of packages. From the standpoints of both quality and productivity in HDD manufacturing, it is therefore necessary to optimize the specifications of FPCs from the conceptual design phase. We have been taking the initiative in developing high-density PCB mounting technologies. We are promoting determination of the specifications of key parts at the initial stage of the design phase and optimization of design in consideration of manufacturing quality, mounting process, and reliability, as well as reliability verification tests. These efforts are making a major contribution to the realization of high-density, high-reliability PCBs suitable. In this report, the process of design and the key technology of high-density mounting have been described.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124116660","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-05-11DOI: 10.23919/ICEP55381.2022.9795497
Yu Shen, Yumeng Ouyang
Sn-0.7Cu is a typical Pb-free solder for electronic packaging, but its strengthening mechanism has not been clear. In this study, we will figure out the main mechanisms for the hardness enhancement of the addition of the 0.7 wt.% Cu on the Sn matrix alloy. The precipitation of Cu-Sn IMC was observed, and the hardness of the Sn-0.7Cu was higher than that of pure Sn. EBSD orientation map shows the large grain size of Sn in the Sn-0.7Cu solder. That proves that the precipitation of the Cu6Sn5 IMC is in the Sn matrix that resists dislocation slips and enhances the hardness of the solder. After thermal aging, the cluster of Cu6Sn5 IMC induces the ~20% decrease in the hardness of the Sn-0.7Cu solder. That can support the net-like structure of the Cu6Sn5 dispersion is the critical mechanism to enhance the strength of the solder.
{"title":"A Study on Strengthening Mechanisms in Sn-0.7Cu via Microstructural Observation, Elemental Distribution, and Grain-Size Analysis","authors":"Yu Shen, Yumeng Ouyang","doi":"10.23919/ICEP55381.2022.9795497","DOIUrl":"https://doi.org/10.23919/ICEP55381.2022.9795497","url":null,"abstract":"Sn-0.7Cu is a typical Pb-free solder for electronic packaging, but its strengthening mechanism has not been clear. In this study, we will figure out the main mechanisms for the hardness enhancement of the addition of the 0.7 wt.% Cu on the Sn matrix alloy. The precipitation of Cu-Sn IMC was observed, and the hardness of the Sn-0.7Cu was higher than that of pure Sn. EBSD orientation map shows the large grain size of Sn in the Sn-0.7Cu solder. That proves that the precipitation of the Cu6Sn5 IMC is in the Sn matrix that resists dislocation slips and enhances the hardness of the solder. After thermal aging, the cluster of Cu6Sn5 IMC induces the ~20% decrease in the hardness of the Sn-0.7Cu solder. That can support the net-like structure of the Cu6Sn5 dispersion is the critical mechanism to enhance the strength of the solder.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114711162","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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