Machine Learning based Temperature Estimation for Test Scheduling of 3D ICs

2020 IEEE International Test Conference India Pub Date : 2020-07-01 DOI:10.1109/ITCIndia49857.2020.9171785

Subhajit Chatterjee, S. Roy, C. Giri, H. Rahaman

引用次数: 1

Abstract

Three-dimensional integrated circuit (3DIC) is an emerging technology with significant benefits over conventional 2DIC. However, 3D ICs face several challenges. This work presents a thermal-aware test scheduling technique for 3DICs. A machine learning based thermal estimation method for 3D ICs has been proposed in this work. The proposed temperature prediction technique has been used to generate thermally safe test schedules for 3DICs. The proposed techniques implemented on ITC’02 benchmark circuits has shown promising results.

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基于机器学习的三维集成电路测试调度温度估计

三维集成电路(3DIC)是一种新兴的技术，与传统的2DIC相比具有显著的优势。然而，3D集成电路面临着一些挑战。本文提出了一种热敏感的3dic测试调度技术。本文提出了一种基于机器学习的三维集成电路热估计方法。所提出的温度预测技术已用于生成3dic的热安全测试计划。所提出的技术在ITC ' 02基准电路上的实现显示出令人满意的结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2020 IEEE International Test Conference India

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