FEA contact element technique and its applications in metal lead forming failure analysis

Lam Tim Fai
{"title":"FEA contact element technique and its applications in metal lead forming failure analysis","authors":"Lam Tim Fai","doi":"10.1109/IPFA.2002.1025610","DOIUrl":null,"url":null,"abstract":"FEA contact element technique has been established and was successfully applied to metal lead forming simulation. One of the commonly encountered lead finish defects, the lead shift problem, was studied in more detail. The results clearly show that the lead shift is due to the unsymmetrical profile of the lead frame used. The FEA results are in good accordance with the experimental measurement.","PeriodicalId":328714,"journal":{"name":"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2002.1025610","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

FEA contact element technique has been established and was successfully applied to metal lead forming simulation. One of the commonly encountered lead finish defects, the lead shift problem, was studied in more detail. The results clearly show that the lead shift is due to the unsymmetrical profile of the lead frame used. The FEA results are in good accordance with the experimental measurement.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
有限元接触单元技术及其在金属引线成形失效分析中的应用
建立了有限元接触单元技术,并成功地应用于金属引线成形模拟。详细地研究了常见的铅面漆缺陷之一——铅移问题。结果清楚地表明,引线移位是由于引线框架的不对称轮廓造成的。有限元分析结果与实验测量结果吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Reliability of copper dual damascene influenced by pre-clean Resistive interconnection localization Impact of oxide degradation on universal mobility behaviour of n-MOS inversion layers Through-silicon IR image to CAD database alignment Correlation between hot carrier stress, oxide breakdown and gate leakage current for monitoring plasma processing induced damage on gate oxide
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1