{"title":"Effects of heat spreader on electrical characteristics of tape-BGA packages","authors":"H. Hasan, A. Cangellaris, R. Kaw, W. Pinello","doi":"10.1109/EPEP.1997.634060","DOIUrl":null,"url":null,"abstract":"Heat spreader is an integral part of a high speed integrated circuit (IC) package. It affects electrical characteristics of interconnects and the radiation behavior of a given package. This paper investigates these effects using several tools developed at the University of Arizona.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634060","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Heat spreader is an integral part of a high speed integrated circuit (IC) package. It affects electrical characteristics of interconnects and the radiation behavior of a given package. This paper investigates these effects using several tools developed at the University of Arizona.
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