Doping of GaN grown on silicon via ion implantation

F. Mazen, M. Coig, A. Lardeau-Falcy, L. Amichi, M. Veillerot, C. Licitra, A. Grenier, J. Biscarrat, J. Kanyandekwe, M. Charles, F. Milési
{"title":"Doping of GaN grown on silicon via ion implantation","authors":"F. Mazen, M. Coig, A. Lardeau-Falcy, L. Amichi, M. Veillerot, C. Licitra, A. Grenier, J. Biscarrat, J. Kanyandekwe, M. Charles, F. Milési","doi":"10.23919/IWJT.2019.8802889","DOIUrl":null,"url":null,"abstract":"Since the last decade, power electronics is moving towards higher frequency and higher voltage applications. For this purpose, the use of silicon (Si) presents some limitations and new materials like Silicon Carbide (SiC) or more recently Gallium Nitride (GaN) have boomed. Because of its large bandgap and high breakdown voltage, GaN is a good candidate for high power device applications, as well as Radio Frequency (RF).","PeriodicalId":441279,"journal":{"name":"2019 19th International Workshop on Junction Technology (IWJT)","volume":"287 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 19th International Workshop on Junction Technology (IWJT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/IWJT.2019.8802889","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Since the last decade, power electronics is moving towards higher frequency and higher voltage applications. For this purpose, the use of silicon (Si) presents some limitations and new materials like Silicon Carbide (SiC) or more recently Gallium Nitride (GaN) have boomed. Because of its large bandgap and high breakdown voltage, GaN is a good candidate for high power device applications, as well as Radio Frequency (RF).
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
离子注入法在硅上生长GaN的掺杂研究
自过去十年以来,电力电子技术正朝着更高频率和更高电压的应用方向发展。为此,硅(Si)的使用存在一些局限性,并且像碳化硅(SiC)或最近的氮化镓(GaN)这样的新材料蓬勃发展。由于其大带隙和高击穿电压,氮化镓是高功率器件应用以及射频(RF)的良好候选者。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Photoluminescence Studies of Sequentially Mg and H Ion-implanted GaN with Various Implantation Depths and Crystallographic Planes Review of applications of Defect Photoluminescence Imaging (DPLI) during IC processing Normally-Off Sputtered-MoS2 nMISFETs with MoSi2 Contact by Sulfur Powder Annealing and ALD Al2O3 Gate Dielectric for Chip Level Integration Fabrication of epitaxial tunnel junction on tunnel field effect transistors [IWJT 2019 Endpage]
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1