Flip chip reliability: comparative characterization of lead free (Sn/Ag/Cu) and 63Sn/Pb eutectic solder

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Pub Date : 2002-08-07 DOI:10.1109/ECTC.2002.1008268

H. Balkan, D. Patterson, G. Burgess, C. Carlson, P. Elenius, M. Johnson, B. Rooney, J. Sanchez, D. Stepniak, J. Wood

{"title":"Flip chip reliability: comparative characterization of lead free (Sn/Ag/Cu) and 63Sn/Pb eutectic solder","authors":"H. Balkan, D. Patterson, G. Burgess, C. Carlson, P. Elenius, M. Johnson, B. Rooney, J. Sanchez, D. Stepniak, J. Wood","doi":"10.1109/ECTC.2002.1008268","DOIUrl":null,"url":null,"abstract":"The reliability of a ternary Sn/Ag/Cu alloy for flip chip solder joints will be reported in this paper. Dominant failure mechanisms for given thermal stress regimes are well defined for 63Sn/Pb eutectic solder. Characterizing Sn/Ag/Cu solder reliability in comparison to 63Sn/Pb solder provides a true baseline for these thermal stress regimes and still allows for a broad search of mechanisms due to the change in alloy properties inherent in this new metallurgic system. Reliability characterization must examine both solder bump and under bump metallization (UBM) robustness, because the interaction between the two contributes to the overall efficacy of the structure. Reported in this work are thermal cycle, high temperature storage, and die shear test results demonstrating the solder bump reliability. Electromigration, multiple reflow, and bare die high temperature test results verifying the UBM robustness are also presented. In addition, the assembly-related details are reported in an effort to provide a foundation for improved yield.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008268","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 14

Abstract

The reliability of a ternary Sn/Ag/Cu alloy for flip chip solder joints will be reported in this paper. Dominant failure mechanisms for given thermal stress regimes are well defined for 63Sn/Pb eutectic solder. Characterizing Sn/Ag/Cu solder reliability in comparison to 63Sn/Pb solder provides a true baseline for these thermal stress regimes and still allows for a broad search of mechanisms due to the change in alloy properties inherent in this new metallurgic system. Reliability characterization must examine both solder bump and under bump metallization (UBM) robustness, because the interaction between the two contributes to the overall efficacy of the structure. Reported in this work are thermal cycle, high temperature storage, and die shear test results demonstrating the solder bump reliability. Electromigration, multiple reflow, and bare die high temperature test results verifying the UBM robustness are also presented. In addition, the assembly-related details are reported in an effort to provide a foundation for improved yield.

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

倒装芯片的可靠性:无铅(Sn/Ag/Cu)和63Sn/Pb共晶焊料的比较特性

本文将报道一种用于倒装焊点的锡银铜三元合金的可靠性。在给定的热应力条件下，63Sn/Pb共晶焊料的主要失效机制是明确的。将Sn/Ag/Cu焊料的可靠性与63Sn/Pb焊料进行比较，为这些热应力体系提供了一个真实的基线，并且仍然允许对这种新冶金体系中固有合金性能变化的机制进行广泛的研究。可靠性表征必须同时检查焊料凹凸和凹凸金属化(UBM)的鲁棒性，因为两者之间的相互作用有助于结构的整体效能。在这项工作中报告了热循环、高温储存和模具剪切试验结果，证明了焊料凸起的可靠性。给出了电迁移、多次回流和裸模高温测试结果，验证了UBM的稳健性。此外，还报告了与组装相关的细节，以便为提高良率提供基础。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

自引率

0.00%

发文量