C. Hu, A. Niknejad, V. Sriramkumar, D. Lu, Y. Chauhan, M. Kahm, A. Sachid
{"title":"BSIM-IMG: A Turnkey compact model for fully depleted technologies","authors":"C. Hu, A. Niknejad, V. Sriramkumar, D. Lu, Y. Chauhan, M. Kahm, A. Sachid","doi":"10.1109/SOI.2012.6404352","DOIUrl":null,"url":null,"abstract":"□ BSIM-IMG is a Turnkey, Production Ready model □ Will be submitted to the CMC for standardization □ Physical, Scalable Core Model for FDSOI devices □ Plethora of Real Device Effects modeled □ Advanced Device Effects — Quantum, Back-gate bias, Self-heating □ Validated on Hardware Data from two FDSOI/ UTBSOI technologies □ Available in major EDA tools.","PeriodicalId":306839,"journal":{"name":"2012 IEEE International SOI Conference (SOI)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International SOI Conference (SOI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.2012.6404352","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
□ BSIM-IMG is a Turnkey, Production Ready model □ Will be submitted to the CMC for standardization □ Physical, Scalable Core Model for FDSOI devices □ Plethora of Real Device Effects modeled □ Advanced Device Effects — Quantum, Back-gate bias, Self-heating □ Validated on Hardware Data from two FDSOI/ UTBSOI technologies □ Available in major EDA tools.
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