{"title":"Automating microassembly with ortho-tweezers and force sensing","authors":"J. A. Thompson, R. Fearing","doi":"10.1109/IROS.2001.977166","DOIUrl":null,"url":null,"abstract":"We describe a microassembly system based on two one degree of freedom probes (\"ortho-tweezers\") and a three degree of freedom translating stage, controlled by a Java application with Python scripting support. We describe how basic manipulation primitives can be combined in a Python script to perform automated, force-feedback controlled assembly operations. We demonstrate a fully automated pick and place task using 200/spl times/200/spl times/100 micron blocks. Using a temporary handling block, the system can manipulate long, thin, fragile parts, such as semiconductor strain gauges.","PeriodicalId":319679,"journal":{"name":"Proceedings 2001 IEEE/RSJ International Conference on Intelligent Robots and Systems. Expanding the Societal Role of Robotics in the the Next Millennium (Cat. No.01CH37180)","volume":"22 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"123","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 2001 IEEE/RSJ International Conference on Intelligent Robots and Systems. Expanding the Societal Role of Robotics in the the Next Millennium (Cat. No.01CH37180)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IROS.2001.977166","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 123
Abstract
We describe a microassembly system based on two one degree of freedom probes ("ortho-tweezers") and a three degree of freedom translating stage, controlled by a Java application with Python scripting support. We describe how basic manipulation primitives can be combined in a Python script to perform automated, force-feedback controlled assembly operations. We demonstrate a fully automated pick and place task using 200/spl times/200/spl times/100 micron blocks. Using a temporary handling block, the system can manipulate long, thin, fragile parts, such as semiconductor strain gauges.