LED design optimization by means of virtual assembly process based on FEM simulation

Abstract

In this study the influence of assembly process steps on reliability behavior of Light Emitting Diodes (LED) products is investigated. A virtual assembly process is developed in Finite Element (FE) model and is validated using experimental results deriving from material characterization as well as robustness results of the LED products. Focus is set on delamination failures and the correlation between failure risk and variations of the assembly process. Additional environmental conditions such as temperature and moisture concentration are taken into account during the assembly process. The FE model gives insights into the relationship between the reliability of the virtual assembled product and the environmental conditions and offers the capability of LED design optimization to ensure the robustness of the products.