Modeling of mixed-mode delamination by cohesive zone method

Bingbing Zhang, Daoguo Yang, L. Ernst, H. Pape
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引用次数: 4

Abstract

Cohesive zone modeling of interface delamination requires proper values of the critical energy release rate of the interfaces being under investigation. In general, these values have been obtained thru dedicated delamination experiments. In cohesive zone modeling a complication to deal with is the fact that the critical energy release rate is not just a single value. Instead, it is a function of the socalled mode-mixity, a parameter depending from the ration between shear stress and tensile stress near the crack front. Most of the standard FEM packages include one or more types of cohesive zone elements, but generally, a mode-mix dependency cannot be specified. This might hinder a proper usage of cohesive zones in FEM modeling of microelectronic components. Therefore, the suitability of various FEM packages to deal with mixed mode delamination through cohesive zone modeling should be explored. The present paper describes such an exploration using the ANSYS package. Various mixed mode delamination experiments have been modeled using an available mixed mode cohesive zone model. The results are compared to the experimental results.
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用内聚带法模拟混合模式分层
界面分层的内聚区建模需要所研究界面的临界能量释放率的适当值。一般来说,这些值都是通过专门的分层实验得到的。在内聚区建模中要处理的一个复杂问题是临界能量释放率不是一个单一的值。相反,它是所谓的模态混合的函数,这是一个参数,取决于裂纹前缘附近的剪切应力和拉应力之间的比率。大多数标准有限元软件包包括一种或多种类型的内聚区单元,但通常不能指定模式-混合依赖关系。这可能会妨碍在微电子元件有限元建模中正确使用粘接区。因此,需要探索各种有限元软件包通过内聚区建模来处理混合模态分层的适用性。本文介绍了利用ANSYS软件包进行的这一探索。利用现有的混合模内聚带模型对各种混合模分层实验进行了建模。计算结果与实验结果进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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