2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2013-06-13DOI: 10.1109/EUROSIME.2013.6529986
Bingbing Zhang, Daoguo Yang, L. Ernst, H. Pape
Cohesive zone modeling of interface delamination requires proper values of the critical energy release rate of the interfaces being under investigation. In general, these values have been obtained thru dedicated delamination experiments. In cohesive zone modeling a complication to deal with is the fact that the critical energy release rate is not just a single value. Instead, it is a function of the socalled mode-mixity, a parameter depending from the ration between shear stress and tensile stress near the crack front. Most of the standard FEM packages include one or more types of cohesive zone elements, but generally, a mode-mix dependency cannot be specified. This might hinder a proper usage of cohesive zones in FEM modeling of microelectronic components. Therefore, the suitability of various FEM packages to deal with mixed mode delamination through cohesive zone modeling should be explored. The present paper describes such an exploration using the ANSYS package. Various mixed mode delamination experiments have been modeled using an available mixed mode cohesive zone model. The results are compared to the experimental results.
{"title":"Modeling of mixed-mode delamination by cohesive zone method","authors":"Bingbing Zhang, Daoguo Yang, L. Ernst, H. Pape","doi":"10.1109/EUROSIME.2013.6529986","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529986","url":null,"abstract":"Cohesive zone modeling of interface delamination requires proper values of the critical energy release rate of the interfaces being under investigation. In general, these values have been obtained thru dedicated delamination experiments. In cohesive zone modeling a complication to deal with is the fact that the critical energy release rate is not just a single value. Instead, it is a function of the socalled mode-mixity, a parameter depending from the ration between shear stress and tensile stress near the crack front. Most of the standard FEM packages include one or more types of cohesive zone elements, but generally, a mode-mix dependency cannot be specified. This might hinder a proper usage of cohesive zones in FEM modeling of microelectronic components. Therefore, the suitability of various FEM packages to deal with mixed mode delamination through cohesive zone modeling should be explored. The present paper describes such an exploration using the ANSYS package. Various mixed mode delamination experiments have been modeled using an available mixed mode cohesive zone model. The results are compared to the experimental results.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130939120","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529930
Yan Liu, Yangjian Xu, Y. Liu
Life prediction of solder die attachment in an automotive power module was studied. Both the energy-based method and the creep-strain-based method were examined and discussed through numerical analysis. Meanwhile, different material constitutive relations for die attach were investigated. For the energy-based life prediction method, Darveaux's fatigue prediction model was implemented to calculate the thermal cycles for crack initiation and propagation, based on the inelastic strain energy density accumulated per cycle during thermal cycling. At the same time, the effective strain method based on creep mechanism was used for comparison with the results from energy-based method. In the implementation of the effective strain method, a FORTRAN subroutine of material constitutive model were developed to couple with the finite element simulation software ANSYS®. In addition, the solder joint fatigue life of low-temperature sintered Nano-silver material was simulated by using both methods. Finally, various solder die attachments with different thicknesses were studied and their fatigue lives were further predicted by effective strain method.
{"title":"Reliability modeling analysis of a power module","authors":"Yan Liu, Yangjian Xu, Y. Liu","doi":"10.1109/EUROSIME.2013.6529930","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529930","url":null,"abstract":"Life prediction of solder die attachment in an automotive power module was studied. Both the energy-based method and the creep-strain-based method were examined and discussed through numerical analysis. Meanwhile, different material constitutive relations for die attach were investigated. For the energy-based life prediction method, Darveaux's fatigue prediction model was implemented to calculate the thermal cycles for crack initiation and propagation, based on the inelastic strain energy density accumulated per cycle during thermal cycling. At the same time, the effective strain method based on creep mechanism was used for comparison with the results from energy-based method. In the implementation of the effective strain method, a FORTRAN subroutine of material constitutive model were developed to couple with the finite element simulation software ANSYS®. In addition, the solder joint fatigue life of low-temperature sintered Nano-silver material was simulated by using both methods. Finally, various solder die attachments with different thicknesses were studied and their fatigue lives were further predicted by effective strain method.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123116059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529951
G. Kravchenko, B. Karunamurthy, M. Nelhiebel, H. Pettermann
This contribution presents a finite element method (FEM) study of fatigue crack formation in Cu metallisation of a power MOSFET device during active cycling using a shear strain based critical plane approach. After a short description of the fatigue model and the procedure for identification of the critical planes, a two-dimensional FEM model of a DMOS cell aimed at computation of detailed stress-strain fields resulting from temperature loading during electrical power pulses is presented. Accumulation of plastic strains, evolution of stresses during the cyclic loading and predictions of the fatigue model is discussed. The predicted most dangerous critical planes satisfactorily correspond to the experimentally observed crack locations in the Cu metallisation showing the potential of the selected methodology.
{"title":"Finite element analysis of fatigue cracks formation in power metallisation of a semiconductor device subjected to active cycling","authors":"G. Kravchenko, B. Karunamurthy, M. Nelhiebel, H. Pettermann","doi":"10.1109/EUROSIME.2013.6529951","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529951","url":null,"abstract":"This contribution presents a finite element method (FEM) study of fatigue crack formation in Cu metallisation of a power MOSFET device during active cycling using a shear strain based critical plane approach. After a short description of the fatigue model and the procedure for identification of the critical planes, a two-dimensional FEM model of a DMOS cell aimed at computation of detailed stress-strain fields resulting from temperature loading during electrical power pulses is presented. Accumulation of plastic strains, evolution of stresses during the cyclic loading and predictions of the fatigue model is discussed. The predicted most dangerous critical planes satisfactorily correspond to the experimentally observed crack locations in the Cu metallisation showing the potential of the selected methodology.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116762360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529983
E. Veninga, R. Kregting, A. E. Van der Waal, A. Gielen
The introduction of new materials or technologies can have an enormous impact on the Time to Market (TTM) of new products. Preferably, the performance of new materials or technologies is known before these are designed into a product. This paper presents a reliability assessment approach which has been developed with the aim to reduce the so called Time to Technology (TTT). The method which is based on an accelerated de-rated strength approach has been expanded to a concept which could also include health monitoring and prognostics during lifetime. In this part of the work a combination of modelling and statistical techniques was used to explore the feasibility and potential of the concept. Ball Grid Array (BGA) designs were used as a vehicle with solder fatigue as the selected failure mechanism. Finite Element Modelling (FEM) together with Design of Experiments (DoE) revealed that the (package) substrate thickness, stand-off, (package) substrate size and the final solder ball diameter are the statistical significant factors with respect to fatigue life of SnAgCu BGA balls. Simplified linear models obtained from regression analyses were used to design de-rated strength variants and estimate test times. Simulations using a strain based lifetime model of Engelmaier together with a Monte Carlo method were used to generate lifetime distributions based on induced variations. A statistical analysis showed a significant difference in lifetime performance between the simulated de-rated strength designs.
{"title":"Novel reliability assessment concept based on an accelerated de-rated strength approach","authors":"E. Veninga, R. Kregting, A. E. Van der Waal, A. Gielen","doi":"10.1109/EUROSIME.2013.6529983","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529983","url":null,"abstract":"The introduction of new materials or technologies can have an enormous impact on the Time to Market (TTM) of new products. Preferably, the performance of new materials or technologies is known before these are designed into a product. This paper presents a reliability assessment approach which has been developed with the aim to reduce the so called Time to Technology (TTT). The method which is based on an accelerated de-rated strength approach has been expanded to a concept which could also include health monitoring and prognostics during lifetime. In this part of the work a combination of modelling and statistical techniques was used to explore the feasibility and potential of the concept. Ball Grid Array (BGA) designs were used as a vehicle with solder fatigue as the selected failure mechanism. Finite Element Modelling (FEM) together with Design of Experiments (DoE) revealed that the (package) substrate thickness, stand-off, (package) substrate size and the final solder ball diameter are the statistical significant factors with respect to fatigue life of SnAgCu BGA balls. Simplified linear models obtained from regression analyses were used to design de-rated strength variants and estimate test times. Simulations using a strain based lifetime model of Engelmaier together with a Monte Carlo method were used to generate lifetime distributions based on induced variations. A statistical analysis showed a significant difference in lifetime performance between the simulated de-rated strength designs.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125948204","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529955
Zhaoli Gao, M. Yuen
A fast-heating scheme is utilized for long VACTN-TIM fabrication directly on metal substrate. VACNT arrays with lengths of more than 100 μm were achieved on Al thin film by a conventional thermal CVD at a low temperature of 600 °C. Our methodology allows patterned VACNT array fabrication using a standard lift-off process for various applications, such as thermal interface materials, super capacitor field emission devices and electronic interconnects.
{"title":"VACNT fabrication on aluminum using “fast-heating” thermal CVD","authors":"Zhaoli Gao, M. Yuen","doi":"10.1109/EUROSIME.2013.6529955","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529955","url":null,"abstract":"A fast-heating scheme is utilized for long VACTN-TIM fabrication directly on metal substrate. VACNT arrays with lengths of more than 100 μm were achieved on Al thin film by a conventional thermal CVD at a low temperature of 600 °C. Our methodology allows patterned VACNT array fabrication using a standard lift-off process for various applications, such as thermal interface materials, super capacitor field emission devices and electronic interconnects.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125340398","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529985
B. Debecker, K. Vanstreels, M. Gonzalez, B. Vandevelde, Z. Tokei
At nanoscale level, the strength of the BEOL is determined by two competing failure mechanisms: adhesive failure (delamination) at the different interfaces and cohesive failure within the Cu-vias or in the low-k material. Different approaches to model delamination by FEM are discussed an evaluated. Although the current techniques are useful for qualitative comparison, it is identified that the future challenge for quantitative reliability modeling lies in tackling fracture initiation and mode mixity. Next, it is examined how the risk for cohesive and adhesive failure evolves in function of the stiffness of the low-k. The potential of our approach is demonstrated by the simulation of different failure mechanisms in some comparative cases.
{"title":"Strength analysis of advanced node BEOL under CPI induced stresses","authors":"B. Debecker, K. Vanstreels, M. Gonzalez, B. Vandevelde, Z. Tokei","doi":"10.1109/EUROSIME.2013.6529985","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529985","url":null,"abstract":"At nanoscale level, the strength of the BEOL is determined by two competing failure mechanisms: adhesive failure (delamination) at the different interfaces and cohesive failure within the Cu-vias or in the low-k material. Different approaches to model delamination by FEM are discussed an evaluated. Although the current techniques are useful for qualitative comparison, it is identified that the future challenge for quantitative reliability modeling lies in tackling fracture initiation and mode mixity. Next, it is examined how the risk for cohesive and adhesive failure evolves in function of the stiffness of the low-k. The potential of our approach is demonstrated by the simulation of different failure mechanisms in some comparative cases.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126986978","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529922
A. L. Zakgeim, A. Chernyakov, A. Vaskou, V. Kononenko, V. Niss
Analysis of the thermal resistance of power light-emitting diodes (LEDs) of Cree and Rebel types is developed. Components of the thermal resistance of the diodes are determined and several distinguishes between different methods are obtained. Behavior of bottleneck effect related to definite interfaces is established. The value of LED active junction area is evaluated too.
{"title":"Comparative analysis of the thermal resistance profiles of power light-emitting diodes cree and rebel types","authors":"A. L. Zakgeim, A. Chernyakov, A. Vaskou, V. Kononenko, V. Niss","doi":"10.1109/EUROSIME.2013.6529922","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529922","url":null,"abstract":"Analysis of the thermal resistance of power light-emitting diodes (LEDs) of Cree and Rebel types is developed. Components of the thermal resistance of the diodes are determined and several distinguishes between different methods are obtained. Behavior of bottleneck effect related to definite interfaces is established. The value of LED active junction area is evaluated too.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122015562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529953
S. Rzepka, R. Pantou, F. Bormann, B. Bramer, I. Brabandt, B. Michel
More and more functionalities will soon be integrated into lightweight structures made of fiber reinforced polymers (FRP). This combines very different materials in minimum space. Consequently, thermo-mechanical risks are of vital concern. The complex stress situation requires a systematic and scalable toolbox of methodologies capable of keeping pace with the growing number and diversity in possible failure risks and sites. The paper reports the status of ongoing work on three expansions to an accelerated test methodology that allows determining the lifetime of FRP structures based on three types of tests: visco-elastic dynamic mechanical analysis, constant strain rate and fatigue tests. The expansions attempt to cover in addition i) various levels of moisture content within the polymer, ii) several laminate stack configurations, and iii) different loading situations including the mix of tension, bending, and shear.
{"title":"Toolbox for visco-elastic material modeling of smart lightweight structures","authors":"S. Rzepka, R. Pantou, F. Bormann, B. Bramer, I. Brabandt, B. Michel","doi":"10.1109/EUROSIME.2013.6529953","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529953","url":null,"abstract":"More and more functionalities will soon be integrated into lightweight structures made of fiber reinforced polymers (FRP). This combines very different materials in minimum space. Consequently, thermo-mechanical risks are of vital concern. The complex stress situation requires a systematic and scalable toolbox of methodologies capable of keeping pace with the growing number and diversity in possible failure risks and sites. The paper reports the status of ongoing work on three expansions to an accelerated test methodology that allows determining the lifetime of FRP structures based on three types of tests: visco-elastic dynamic mechanical analysis, constant strain rate and fatigue tests. The expansions attempt to cover in addition i) various levels of moisture content within the polymer, ii) several laminate stack configurations, and iii) different loading situations including the mix of tension, bending, and shear.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129592286","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529903
S. Hartmann, O. Holck, B. Wunderle
CNT/metal interfaces under mechanical loads are investigated using molecular dynamics by simulating pull-out tests of single walled carbon nanotubes (CNTs) emdedded in single crystal gold lattices. As a result of our simulations we present obtained force-displacement data. We investigated the influence of two different Lennard Jones (LJ) coefficients pairs, two CNT types and three lattice directions of the gold matrix with respect to the embedding direction. Additionally we incorporated structural defects into our model and report on their influence. The change of the CNT type leads to a change in the maximum pull-out force. Here we attribute this to the change in CNT diameter, where a bigger diameter entails an increased maximum pull-out force. Changing the LJ coefficient pair has a strong impact on the maximum pull-out forces, where a higher bonding energy results in a higher maximum pull-out force. Defects also show a positive effect on the maximum pull-out force. The presented results have impact on bonding strength of CNT/metal interfaces.
采用分子动力学方法，模拟嵌套在单晶金晶格中的单壁碳纳米管(CNTs)的拉出实验，研究了机械载荷作用下碳纳米管/金属界面。作为我们模拟的结果，我们给出了得到的力-位移数据。研究了两种不同的Lennard Jones (LJ)系数对、两种碳纳米管类型和金基体的三种晶格方向对嵌入方向的影响。此外，我们将结构缺陷纳入我们的模型并报告其影响。碳纳米管类型的变化导致最大拔出力的变化。在这里，我们将其归因于碳纳米管直径的变化，其中更大的直径需要增加的最大拔出力。改变LJ系数对最大拉出力有很大影响，其中键能越高，最大拉出力越大。缺陷对最大拔出力也有积极的影响。研究结果对碳纳米管/金属界面的结合强度有影响。
{"title":"Molecular dynamics simulations for mechanical characterization of CNT/gold interface and its bonding strength","authors":"S. Hartmann, O. Holck, B. Wunderle","doi":"10.1109/EUROSIME.2013.6529903","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529903","url":null,"abstract":"CNT/metal interfaces under mechanical loads are investigated using molecular dynamics by simulating pull-out tests of single walled carbon nanotubes (CNTs) emdedded in single crystal gold lattices. As a result of our simulations we present obtained force-displacement data. We investigated the influence of two different Lennard Jones (LJ) coefficients pairs, two CNT types and three lattice directions of the gold matrix with respect to the embedding direction. Additionally we incorporated structural defects into our model and report on their influence. The change of the CNT type leads to a change in the maximum pull-out force. Here we attribute this to the change in CNT diameter, where a bigger diameter entails an increased maximum pull-out force. Changing the LJ coefficient pair has a strong impact on the maximum pull-out forces, where a higher bonding energy results in a higher maximum pull-out force. Defects also show a positive effect on the maximum pull-out force. The presented results have impact on bonding strength of CNT/metal interfaces.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"140 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129024878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-04-14DOI: 10.1109/EUROSIME.2013.6529926
Gang Cao, Chaojun Liu, Xiaogang Liu, Xuefang Wang, Sheng Liu
This paper models two structures for simulating the resistance electric field dependence of piezoresistor in silicon pressure sensor. The difference of the two structures is one with a shield layer and the other one without it. The simulation results show that the shield layer can shield the electric field no matter where it origins externally or it is caused by fixed oxide charges, which is very useful to improve the stability of the piezoresistor.
{"title":"Resistance electric filed dependence simulation of piezoresistive silicon pressure sensor and improvement by shield layer","authors":"Gang Cao, Chaojun Liu, Xiaogang Liu, Xuefang Wang, Sheng Liu","doi":"10.1109/EUROSIME.2013.6529926","DOIUrl":"https://doi.org/10.1109/EUROSIME.2013.6529926","url":null,"abstract":"This paper models two structures for simulating the resistance electric field dependence of piezoresistor in silicon pressure sensor. The difference of the two structures is one with a shield layer and the other one without it. The simulation results show that the shield layer can shield the electric field no matter where it origins externally or it is caused by fixed oxide charges, which is very useful to improve the stability of the piezoresistor.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114217014","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：