Fabrication challenge, device characterization of high-Q 2D, 3D passives devices on glass

Sheng-Chi Hsieh, Chien-Hua Chen, Yung-shun Chang, T. Lee, Pao-Nan Lee, Chen-Chao Wang, Yuan-Hsi Chou
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引用次数: 2

Abstract

It is demonstrated that the high quality factor of thick metal spiral inductors, 3D solenoid inductor and low harmonics power level can be achieved by using a mature glass substrate technology. The quality factor of inductors in a 2D/3D type can achieve 70∼100 in this study. The harmonics power level is measured along transmission line and 2nd /3rd harmonics can be below −110 dBm at 30 dBm input power. It is very critical and helpful with high Q-factor and lower harmonics power level for the FEM development of current and next generation's commercial 4G carrier aggregation system.
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玻璃上高q 2D, 3D无源器件的制造挑战,器件特性
结果表明,采用成熟的玻璃基板技术,可以实现厚金属螺旋电感、三维电磁电感的高品质因数和低谐波功率水平。在本研究中,2D/3D类型电感器的质量因子可以达到70 ~ 100。沿传输线测量谐波功率电平,在输入功率为30dbm时,2 /3次谐波可低于- 110dbm。高q因子和低谐波功率水平对当前和下一代商用4G载波聚合系统的有限元开发至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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