Using High-Speed Video Analysis for Defect Investigation and Process Improvement

Abstract

We demonstrate the application of high-speed video analysis to Wet Etch and Cleans process and equipment improvements in a high-volume semiconductor manufacturing environment. Through high-temporal-resolution video usage, a method of analysis was developed for systematic defect reduction, yield improvement, and cost reduction efforts. Three case studies are presented showing utility of high-speed video analysis that led to defect origin isolation from faulty equipment, chemical usage reduction saving almost 30% in costs per year, and high-speed capture to analyze flow-controller dependent flow stabilizations.