{"title":"Corrosion behavior of Sn-Zn-Bi and Sn-Pb-Ag solders in a salt spray test","authors":"M. Mostofizadeh, L. Frisk","doi":"10.1109/ESTC.2014.6962850","DOIUrl":null,"url":null,"abstract":"Most of the commonly used lead-free solders have a high melting temperature. However, in many applications a lower processing temperature would be beneficial. Therefore a demand has arisen for reliable lead-free solder with a lower melting temperature. Among the low temperature lead-free solders, Sn-9Zn and Sn-8Zn-3Bi (wt.%) are suitable candidates for many applications, since they offer good mechanical reliability and melting temperature similar to that of Sn-Pb solders. However, because they contain an active element (Zn), they need to be used with caution, especially in corrosive environments and in high-temperature applications. In this paper the corrosion behavior of Sn-8Zn-3Bi lead-free solder was studied using a salt spray test. The microstructure of the solder was studied at different time intervals during the salt spray test. Sn-36Pb-2Ag (wt.%) solder joints were also studied as reference samples. It was found that Sn-8Zn-3Bi suffered from galvanic corrosion earlier than the Sn-Pb-2Ag solders. However, considerable corrosion was observed after the salt spray test in both solders. Moreover, it seemed that the corrosion performance of Sn-Pb-2Ag solder was better than that of Sn-8Zn-3Bi solder.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962850","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Most of the commonly used lead-free solders have a high melting temperature. However, in many applications a lower processing temperature would be beneficial. Therefore a demand has arisen for reliable lead-free solder with a lower melting temperature. Among the low temperature lead-free solders, Sn-9Zn and Sn-8Zn-3Bi (wt.%) are suitable candidates for many applications, since they offer good mechanical reliability and melting temperature similar to that of Sn-Pb solders. However, because they contain an active element (Zn), they need to be used with caution, especially in corrosive environments and in high-temperature applications. In this paper the corrosion behavior of Sn-8Zn-3Bi lead-free solder was studied using a salt spray test. The microstructure of the solder was studied at different time intervals during the salt spray test. Sn-36Pb-2Ag (wt.%) solder joints were also studied as reference samples. It was found that Sn-8Zn-3Bi suffered from galvanic corrosion earlier than the Sn-Pb-2Ag solders. However, considerable corrosion was observed after the salt spray test in both solders. Moreover, it seemed that the corrosion performance of Sn-Pb-2Ag solder was better than that of Sn-8Zn-3Bi solder.