{"title":"Approach to solve the reliability problem at packaging level in the matrix VLSI","authors":"I. Vasiltsov, B. Mandziy, A. Bench","doi":"10.1109/MIEL.2002.1003355","DOIUrl":null,"url":null,"abstract":"In this paper the problem of increasing the reliability of the designed devices, implemented on the matrix VLSI has been considered. The proposed approach consists in choosing of the special area in the chip during mapping procedure at the packaging level. Usage of such approach allows for the designer to obtain a more optimal topology solution, and thus will increase the reliability of designed devices.","PeriodicalId":221518,"journal":{"name":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2002 23rd International Conference on Microelectronics. Proceedings (Cat. No.02TH8595)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MIEL.2002.1003355","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper the problem of increasing the reliability of the designed devices, implemented on the matrix VLSI has been considered. The proposed approach consists in choosing of the special area in the chip during mapping procedure at the packaging level. Usage of such approach allows for the designer to obtain a more optimal topology solution, and thus will increase the reliability of designed devices.
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