A fault injection platform for the analysis of soft error effects in FPGA soft processors

Aitzan Sari, M. Psarakis
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引用次数: 10

Abstract

Soft processors in SRAM-based FPGAs are gaining acceptance as enabling technology for building embedded systems in several market domains, even for critical applications such as space, transportation and medical devices. However, due to the high vulnerability of SRAM-based FPGAs to single-event upsets (SEUs), which is expected to be aggravated in the future, as FPGA devices are moving aggressively to the nanometer regime, the hardening of soft processors against soft errors will become a major design issue especially for critical applications. Most SEU mitigation approaches proposed in the past are based on the triplication or duplication techniques, thus imposing significant area and performance overheads. A more detailed analysis of the soft error sensitivity of FPGA soft processor and their faulty behavior will enable the development of efficient, low-cost hardening techniques. To this end, we present a fault injection platform based on an open-source CAD framework (RapidSmith) for the analysis of soft error effects in Xilinx FPGA soft processors. Our platform supports the estimation of soft error sensitivity per configuration bit/frame, processor component and benchmark. An on-chip microcontroller is used to inject and correct soft errors in the configuration memory and monitor target processor behavior. It includes a custom peripheral to monitor and record specific processor signals (e.g. exception signals, performance counters) which may manifest the effects of soft errors. The proposed platform is demonstrated through an extensive fault injection campaign in the Leon3 soft processor. The novelty of the framework is it's availability as open-source fault-injection tool designed to target soft processors and the introduction of fault identification by using performance counter.
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FPGA软处理器软误差效应分析的故障注入平台
基于sram的fpga中的软处理器正在获得认可,作为在多个市场领域构建嵌入式系统的使能技术,甚至适用于空间,运输和医疗设备等关键应用。然而,由于基于sram的FPGA对单事件干扰(seu)的高度脆弱性,预计在未来会加剧,因为FPGA器件正在积极地向纳米方向发展,软处理器针对软错误的硬化将成为一个主要的设计问题,特别是对于关键应用。过去提出的大多数SEU缓解方法都是基于复制或复制技术,因此带来了巨大的面积和性能开销。更详细地分析FPGA软处理器的软误差敏感性及其故障行为将有助于开发高效、低成本的硬化技术。为此,我们提出了一个基于开源CAD框架(RapidSmith)的故障注入平台,用于分析Xilinx FPGA软处理器中的软误差效应。我们的平台支持每个配置位/帧、处理器组件和基准的软错误灵敏度估计。片上微控制器用于注入和纠正配置存储器中的软错误,并监视目标处理器的行为。它包括一个自定义外设,用于监视和记录可能显示软错误影响的特定处理器信号(例如异常信号,性能计数器)。通过在Leon3软处理器中进行广泛的故障注入活动来演示所提出的平台。该框架的新颖之处在于它可以作为针对软处理器设计的开源故障注入工具,并通过使用性能计数器引入故障识别。
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