Area selective gold MOCVD for VLSI electronics

S.D. Colgate, G.J. Palenik, V. E. House, D. Schoenfeld, C. Simon
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Abstract

Summary form only given. Area-selective metal-organic chemical vapor deposition (MOCVD) of gold thin films has been achieved on tungsten patterned on VLSI-type silicon wafers. Scanning Auger spectroscopy of the wafer deposition areas displays virtual exclusion of gold deposits on silicious regions with 4000-AA-thick gold films of high feature resolution covering the tungsten patterns. The films were deposited by exposing the heated wafer (T<500 degrees C) to an ambient of (C/sub 2/H/sub 5/)/sub 3/PAuCl vapor for 1 h.<>
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用于VLSI电子器件的面积选择性金MOCVD
只提供摘要形式。在大面积集成电路型硅片上实现了选择性金属有机化学气相沉积(MOCVD)金薄膜。晶圆沉积区域的扫描俄歇光谱显示,硅质区域几乎不存在金矿,4000- aa厚的高特征分辨率的金膜覆盖在钨图案上。通过加热晶圆片(T>)
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