Investigation of power semiconductor devices under applying voltage by multi-purpose scanning probe microscope

N. Satoh, A. Doi, H. Yamamoto
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Abstract

Power semiconductor devices are progressing towards high-withstand voltage using wide bandgap semiconductor materials as well as having the ability to flow a significant amount of current by multi-parallel integration using the microfabrication technique. A power semiconductor device under a bias voltage applied condition by a scanning probe microscope (SPM) was successfully observed, combined with atomic force microscopy (AFM), Kelvin probe force microscopy (KFM), and scanning capacitance force microscopy (SCFM). Using the SPM analysis, both, a high spatial-resolution and high sensitivity was achieved.
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应用多用途扫描探针显微镜研究电压作用下的功率半导体器件
功率半导体器件正朝着使用宽带隙半导体材料的高耐压方向发展,并通过使用微加工技术进行多并行集成,从而具有流动大量电流的能力。利用扫描探针显微镜(SPM),结合原子力显微镜(AFM)、开尔文探针力显微镜(KFM)和扫描电容力显微镜(SCFM),成功地观察了施加偏置电压条件下的功率半导体器件。利用SPM分析,获得了高空间分辨率和高灵敏度。
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