A multidisciplinary approach for effective packaging of MEMS accelerometer

Abstract

Micro-electro-mechanical systems (MEMS) packaging is becoming increasingly critical and plays a major role in the successful commercialization of MEMS product. The packaging system should eable the MEMS perform the sensing function and at the same time protect it from the environmental disturbance, and help improve product quality to the sub-ppm level. One of our accelerometers in an SOIC package experienced a low ppm occurrence of device fracture. This MEMS package is unique in that the package has to maintain a certain resonance frequency to protect the transducer from sticking or clipping. At the same time, the package has to deliver a reliable and intact transducer with no cracking or output offset. A multidisciplinary approach inclusive of vibration analysis, electrical response determination, stress analysis, and fracture mechanics was used to determine the appropriate die attach material to completely resolve the device fracture issue.