Advanced Process Control Model for Trench Shape of Power Devices

Takumi Ito, Wang Xueting, Y. Oomuro, Kazutaka Nagashima
{"title":"Advanced Process Control Model for Trench Shape of Power Devices","authors":"Takumi Ito, Wang Xueting, Y. Oomuro, Kazutaka Nagashima","doi":"10.1109/ISSM55802.2022.10026901","DOIUrl":null,"url":null,"abstract":"In the semiconductor manufacturing, the manufacturing equipment is managed via the quality control (QC). The shape of the pattern is checked whether it meets the specification. If the shape is out of the specification, some recipe parameters are modified so that the shape meets the specification. The calculation method of the recipe parameters depends on the know-how of the individual engineers, which causes difficulties in the QC. We develop the automatic calculation of the optimal recipe parameters with Advanced Process Control (APC) model in order to solve these problems.","PeriodicalId":130513,"journal":{"name":"2022 International Symposium on Semiconductor Manufacturing (ISSM)","volume":"100 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Symposium on Semiconductor Manufacturing (ISSM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM55802.2022.10026901","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

In the semiconductor manufacturing, the manufacturing equipment is managed via the quality control (QC). The shape of the pattern is checked whether it meets the specification. If the shape is out of the specification, some recipe parameters are modified so that the shape meets the specification. The calculation method of the recipe parameters depends on the know-how of the individual engineers, which causes difficulties in the QC. We develop the automatic calculation of the optimal recipe parameters with Advanced Process Control (APC) model in order to solve these problems.
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动力装置沟槽形状的先进过程控制模型
在半导体制造中,通过质量控制(QC)对制造设备进行管理。检查图案的形状是否符合规格。如果形状不符合规格,则修改一些配方参数以使形状符合规格。配方参数的计算方法取决于工程师个人的专业知识,这给质量控制带来了困难。为了解决这些问题,我们开发了先进过程控制(APC)模型自动计算最优配方参数。
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