R. Biedorf, R. Heinze, A. Wollanke, K. Wolter, T. Zerna, A. Plotzke
{"title":"Alternative bumping processes for DRAM-CSP","authors":"R. Biedorf, R. Heinze, A. Wollanke, K. Wolter, T. Zerna, A. Plotzke","doi":"10.1109/ECTC.2002.1008299","DOIUrl":null,"url":null,"abstract":"The usual assembly of CSP on printed circuit boards requires a relatively high volume of solder paste in a very small pitch. That's why a multiple step process is used with bumping of the interposer using pre-formed solder balls, with screen printing of solder paste on the substrate and with an reflow soldering step. In this paper three variants of bumping of CSP are discussed and some results of optimising the bumping and the assembly process of CSP are presented.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008299","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The usual assembly of CSP on printed circuit boards requires a relatively high volume of solder paste in a very small pitch. That's why a multiple step process is used with bumping of the interposer using pre-formed solder balls, with screen printing of solder paste on the substrate and with an reflow soldering step. In this paper three variants of bumping of CSP are discussed and some results of optimising the bumping and the assembly process of CSP are presented.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
