Impact of substrate orientation on Ultra Thin BOX Fully Depleted SOI electrical performances

I. Ben Akkez, C. Fenouillet-Béranger, A. Cros, P. Perreau, S. Haendler, O. Weber, F. Andrieu, D. Pellissier-Tanon, F. Abbate, C. Richard, R. Beneyton, P. Gouraud, A. Margain, C. Borowiak, E. Gourvest, K. Bourdelle, B. Nguyen, T. Poiroux, T. Skotnicki, O. Faynot, F. Balestra, G. Ghibaudo, F. Boeuf
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Abstract

In this paper, we compare the electrical properties of Ultra Thin Buried Oxide (UTBOX) Fully Depleted Silicon On Insulator (FD-SOI) MOS devices for rotated and not rotated substrate with different gate lengths. We found a significant performance enhancement on FD-SOI PMOSFETs as expected, while keeping a good control of short channel effects. Surprisingly, to a lower extent, an improvement is also found for NMOS devices. We have also studied the carrier mobility degradation as a function of temperature and we point out the contribution of different mechanisms that reduce the mobility such as impurity Coulomb scattering, phonons and neutral defects as a function gate length. We find that there is no significant effect of rotated substrate on the mobility degradation. All these results are discussed and possible explanations are also given.
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衬底取向对超薄盒完全耗尽SOI电性能的影响
在本文中,我们比较了不同栅极长度的旋转和非旋转衬底下超薄埋藏氧化物(UTBOX)全耗尽绝缘体上硅(FD-SOI) MOS器件的电学性能。我们发现FD-SOI pmosfet的性能如预期的那样显著增强,同时保持了对短通道效应的良好控制。令人惊讶的是,在较低程度上,NMOS器件也得到了改进。我们还研究了载流子迁移率随温度的下降,并指出了不同的机制对降低迁移率的贡献,如杂质库仑散射、声子和中性缺陷作为函数门长度。我们发现旋转底物对迁移率的降解没有明显的影响。对这些结果进行了讨论,并给出了可能的解释。
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