{"title":"The future of computing is mobile","authors":"N. Yu","doi":"10.1109/EDSSC.2013.6628034","DOIUrl":null,"url":null,"abstract":"Summary form only given. Mobile wireless devices have become a necessity in everyday life, are redefining mobile possibilities for people everywhere, and are enabling significant societal changes. They have also become important product drivers for the semiconductor industry. The product market landscape has been driven by an insatiable demand for data speeds, device features, sleek appearances and increased battery life. By integrating the functionality of the CPU, the GPU, connectivity, multimedia and GPS with optimal performance and power consumption, Qualcomm's chipsets are finding applications in Smartphones as well as other Mobile Computing applications. This talk will outline the key technology elements required in the implementation of Qualcomm's chip sets. The development and cost-effective fabrication of ever more complex chip sets to meet the needs of future products requires increased innovation and integration in critical areas such as architecture, circuit design, process technology and packaging. In addition a continued focus on evolving the successful fabless model and managing cost will be discussed.","PeriodicalId":333267,"journal":{"name":"2013 IEEE International Conference of Electron Devices and Solid-state Circuits","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2013-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Conference of Electron Devices and Solid-state Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2013.6628034","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Summary form only given. Mobile wireless devices have become a necessity in everyday life, are redefining mobile possibilities for people everywhere, and are enabling significant societal changes. They have also become important product drivers for the semiconductor industry. The product market landscape has been driven by an insatiable demand for data speeds, device features, sleek appearances and increased battery life. By integrating the functionality of the CPU, the GPU, connectivity, multimedia and GPS with optimal performance and power consumption, Qualcomm's chipsets are finding applications in Smartphones as well as other Mobile Computing applications. This talk will outline the key technology elements required in the implementation of Qualcomm's chip sets. The development and cost-effective fabrication of ever more complex chip sets to meet the needs of future products requires increased innovation and integration in critical areas such as architecture, circuit design, process technology and packaging. In addition a continued focus on evolving the successful fabless model and managing cost will be discussed.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
未来的计算是移动的
只提供摘要形式。移动无线设备已成为日常生活的必需品,正在为世界各地的人们重新定义移动可能性,并正在实现重大的社会变革。它们也成为半导体行业重要的产品驱动因素。对数据速度、设备功能、时尚外观和延长电池寿命的永不满足的需求推动了产品市场格局。通过将CPU、GPU、连接、多媒体和GPS的功能与最佳性能和功耗相结合,高通的芯片组正在智能手机以及其他移动计算应用中找到应用。本讲座将概述高通芯片组实现所需的关键技术要素。为了满足未来产品的需求,越来越复杂的芯片组的开发和成本效益的制造需要在架构,电路设计,工艺技术和封装等关键领域增加创新和集成。此外,我们还将讨论如何持续发展成功的无晶圆厂模式和管理成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A 116-dB CMOS op amp with repetitive gain boosting and subthreshold operation A novel design of super-capcitor based on black silicon with atomic layer deposition Analysis on the CTLM and LTLM applicability for GaN HEMTs structure alloyed ohmic contact resistance evaluation A PWM controller with table look-up for DC-DC class E buck/boost conversion Failure analysis of output stage due to ESD stress in submicron CMOS technology
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1