{"title":"Complementary Incentives of Yield and Reliability for Ensuring Defect Detections in Wafer-Manufacturing","authors":"L. Sheng, Wei Pan, Zdenek Axman, V. Bucek","doi":"10.1109/ASMC.2019.8791821","DOIUrl":null,"url":null,"abstract":"Yield defects and reliability defects in wafer- manufacturing are often related. To vividly illustrate in detail the complementary incentives of yield and reliability, we have provided in this paper a case study of ensuring the defect detections. In addition, an extensive review was also provided for the first time from I-V characteristics of defects to stress test failures at product sort. Our broad and multidisciplinary efforts have safeguarded the defect detections in quality manufacturing.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791821","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Yield defects and reliability defects in wafer- manufacturing are often related. To vividly illustrate in detail the complementary incentives of yield and reliability, we have provided in this paper a case study of ensuring the defect detections. In addition, an extensive review was also provided for the first time from I-V characteristics of defects to stress test failures at product sort. Our broad and multidisciplinary efforts have safeguarded the defect detections in quality manufacturing.