Reliability concerns in contemporary SiC power devices

R. Singh, A. Hefner, T. R. McNutt
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引用次数: 10

Abstract

This paper attempts to show some of the reliability issues faced by contemporary SiC power devices. Material defects in SiC are the cause of many reliability issues in the SiC devices, such as (a) reduced critical electric field in devices, (b) higher leakage currents during reverse bias operation and (c) degradation in the on-state performance of bipolar devices. Detailed experiments conducted on SiC devices have shown that the on-state voltage drop on these devices increases with time when they are kept in the forward biased mode for appreciable length of time.
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当代SiC功率器件的可靠性问题
本文试图展示当代SiC功率器件所面临的一些可靠性问题。SiC中的材料缺陷是SiC器件中许多可靠性问题的原因,例如(a)器件中的临界电场降低,(b)反向偏置操作期间泄漏电流增加以及(c)双极器件的导通状态性能下降。在SiC器件上进行的详细实验表明,当器件保持在正向偏置模式相当长一段时间时,其导通状态压降随时间而增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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