Imaging in Short-Wave Infrared with 1.82 μm Pixel Pitch Quantum Dot Image Sensor

Jiwon Lee, Epimitheas Georgitzikis, Yunlong Li, Ziduo Lin, Jihoon Park, I. Lieberman, D. Cheyns, M. Jayapala, A. Lambrechts, S. Thijs, R. Stahl, P. Malinowski
{"title":"Imaging in Short-Wave Infrared with 1.82 μm Pixel Pitch Quantum Dot Image Sensor","authors":"Jiwon Lee, Epimitheas Georgitzikis, Yunlong Li, Ziduo Lin, Jihoon Park, I. Lieberman, D. Cheyns, M. Jayapala, A. Lambrechts, S. Thijs, R. Stahl, P. Malinowski","doi":"10.1109/IEDM13553.2020.9372018","DOIUrl":null,"url":null,"abstract":"A high pixel density image sensor for the Short Wave Infrared (SWIR) range is presented. A PbS quantum dot (QD) photodiode array is monolithically integrated on a silicon custom readout IC. Imaging in VIS and SWIR is demonstrated using focal plane arrays with pixel pitch down to record 1.82 μm. Through-silicon vision and lens-free imaging (LFI) microscopy are shown as applications that can benefit from high resolution/small pixel dimensions. In the LFI demonstration, the captured hologram is computationally reconstructed to acquire SWIR microscopic images, resulting in a wavelength equivalent resolution LFI microscopy system. To our knowledge, this is the smallest pitch SWIR pixel ever reported and the first LFI system using a QD image sensor.","PeriodicalId":415186,"journal":{"name":"2020 IEEE International Electron Devices Meeting (IEDM)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM13553.2020.9372018","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16

Abstract

A high pixel density image sensor for the Short Wave Infrared (SWIR) range is presented. A PbS quantum dot (QD) photodiode array is monolithically integrated on a silicon custom readout IC. Imaging in VIS and SWIR is demonstrated using focal plane arrays with pixel pitch down to record 1.82 μm. Through-silicon vision and lens-free imaging (LFI) microscopy are shown as applications that can benefit from high resolution/small pixel dimensions. In the LFI demonstration, the captured hologram is computationally reconstructed to acquire SWIR microscopic images, resulting in a wavelength equivalent resolution LFI microscopy system. To our knowledge, this is the smallest pitch SWIR pixel ever reported and the first LFI system using a QD image sensor.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
1.82 μm像素间距量子点图像传感器短波红外成像研究
提出了一种用于短波红外(SWIR)范围的高像素密度图像传感器。将PbS量子点(QD)光电二极管阵列单片集成在硅自定义读出IC上。使用焦平面阵列演示了VIS和SWIR成像,像素间距降至1.82 μm。通过硅视觉和无透镜成像(LFI)显微镜显示的应用可以受益于高分辨率/小像素尺寸。在LFI演示中,捕获的全息图被计算重建以获得SWIR显微图像,从而产生波长等效分辨率的LFI显微系统。据我们所知,这是有史以来报道的最小螺距SWIR像素,也是第一个使用QD图像传感器的LFI系统。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Subband Engineering by Combination of Channel Thickness Scaling and (111) Surface Orientation in InAs-On-Insulator nMOSFETs A Reliability Enhanced 5nm CMOS Technology Featuring 5th Generation FinFET with Fully-Developed EUV and High Mobility Channel for Mobile SoC and High Performance Computing Application Scaling MoS2 NCFET to 83 nm with Record-low Ratio of SSave/SSRef.=0.177 and Minimum 20 mV Hysteresis Future Logic Scaling: Towards Atomic Channels and Deconstructed Chips An Improved Model on Buried-Oxide Damage for Total-Ionizing-Dose Effect on HV SOI LDMOS
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1