28nm FDSOI Platform with Embedded PCM for IoT, ULP, Digital, Analog, Automotive and others Applications

F. Arnaud, S. Haendler, S. Clerc, R. Ranica, A. Gandolfo, O. Weber
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Abstract

This paper proposes a general overview of Fully Depleted Silicon On Insulator (FDSOI) technology advantages leveraging body bias capability as a key enabler for digital, analog and memories performance enhancement. 2x total power contraction for digital designs has been demonstrating without any frequency degradation thanks to Forward Body Biasing (FBB), combined with 70% transistor variability reduction. Power of analog blocks has been strongly reduced with body bias technique while keeping trans-conductance efficiency increasing and output voltage gain. Finally, excellent memories performances has been achieved by applying FBB/RBB solution, dropping the leakage of unselected word-line in Phase Change Memory (PCM) array and improving Vmin operation for static RAM across a wide temperature range.
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28nm FDSOI平台,嵌入式PCM,适用于物联网,ULP,数字,模拟,汽车和其他应用
本文概述了利用体偏置能力作为数字、模拟和存储性能增强的关键推动者的完全耗尽绝缘体上硅(FDSOI)技术优势。由于前向体偏置(FBB),数字设计的总功率收缩了2倍,而没有任何频率降低,同时晶体管可变性降低了70%。体偏置技术大大降低了模拟模块的功率,同时保持了跨导效率的提高和输出电压的增益。最后,采用FBB/RBB解决方案,降低了相变存储器(PCM)阵列中未选择字线的泄漏,并改善了静态RAM在宽温度范围内的Vmin操作,从而获得了优异的存储性能。
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