Total Ionizing Dose Hardness Enhancement at Room Temperature in CMOS 0.25µm Technology

G. Cussac, L. Artola, T. Nuns, S. Ducret
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Abstract

This work presents electricals characteristics of primary and secondly irradiated MOSFET transistors. Secondly irradiated transistors after nominal operation recovery showed a great TID resistance betterment. This improvement is allowed by latent interface traps charge build-up during long time annealing. Latent interface traps effects on electrical degradation at STI level are physically explained with simulation and experiment comparison.
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CMOS 0.25µm技术室温下总电离剂量硬度增强
本文介绍了一次辐照和二次辐照的MOSFET晶体管的电学特性。其次,经辐照后的晶体管在标称运算恢复后,其阻抗有较大的改善。这种改进是由于在长时间退火过程中潜在的界面陷阱电荷的积累。通过仿真和实验对比,从物理上解释了潜在界面陷阱对STI水平电退化的影响。
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