Global technical and commercial developments with flip chip technology

Abstract

Flip chip technology includes any combination of techniques that directly mounts a silicon die with its active area face down to a substrate. Flip chip technology has been in use in the electronics industry for over thirty years. Worldwide less than ten companies practice the technology in volume. Over 90% of volume flip chip applications are low leadcount ones for watches, vehicle modules, displays and communications modules. Flip chip will be accelerated by three strong new market drivers: access to high leadcount single chip silicon; use in low profile portable products; proliferation of radio frequency devices. Electrolytic plating and solder reflow assembly techniques will remain dominant, but direct application of solder by stud bumping and related techniques must be carefully watched.