A new 3-D MCM fabrication technology for high-speed chip-to-chip communication: vertically connected thin-film chip (VCTC) technology

Abstract

A new 3-D MCM fabrication technology referred as "Vertically Connected Thin-film Chip (VCTC)" technology, has been developed. The VCTC process consists of chip thinning by CMP, the thinned-chip stacking by polyimide adhesive, and vertical interconnection formation by polyimide dry-etching and gold plating. From the SPICE simulation, short line length is a main factor to realize high-speed inter-chip communication with small delay, so the VCTC technology is effective on high-speed systems.