A low thermal budget, fully self-aligned lateral BJT on thin film SOI substrate for low power BiCMOS applications

V. Chen, J. Woo
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引用次数: 5

Abstract

A novel SDE LBJT on TFSOI substrate has been demonstrated. The fabrication process is self-aligned, with a minimum thermal budget, and is fully compatible with an SOI CMOS process. Good electrical results were obtained. The devices are expected to have good current drive and high frequency performance for low power applications.
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用于低功耗BiCMOS应用的薄膜SOI衬底上的低热预算,完全自对准横向BJT
在TFSOI衬底上制备了一种新型的SDE LBJT。制造工艺是自对准的,具有最小的热预算,并且与SOI CMOS工艺完全兼容。获得了良好的电学效果。该器件有望在低功耗应用中具有良好的电流驱动和高频性能。
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Semiconductor CIM system, innovation toward the year 2000 CVD SiN/sub X/ anti-reflective coating for sub-0.5 /spl mu/m lithography Advantage of small geometry silicon MOSFETs for high-frequency analog applications under low power supply voltage of 0.5 V The influence of oxygen at epitaxial Si/Si substrate interface for 0.1 /spl mu/m epitaxial Si channel N-MOSFETs grown by UHV-CVD High-current, small parasitic capacitance MOS FET on a poly-Si interlayered (PSI: /spl Psi/) SOI wafer
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