V. Masteika, T. Rogers, R. Santilli, S. Fraser, M. Y. A. Aioubi
{"title":"Automatic Maszara testing jig","authors":"V. Masteika, T. Rogers, R. Santilli, S. Fraser, M. Y. A. Aioubi","doi":"10.23919/LTB-3D.2017.7947458","DOIUrl":null,"url":null,"abstract":"We have produced a new, automated Maszara testing tool. This tool can be used to measure the bond strength across the entire interface of a bonded wafer pair and produce a bond strength map. The tool can also be used for IR inspection.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947458","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We have produced a new, automated Maszara testing tool. This tool can be used to measure the bond strength across the entire interface of a bonded wafer pair and produce a bond strength map. The tool can also be used for IR inspection.