Power Delivery Decoupling Scheme for EMIB Packages

Abstract

The embedded multi-die interconnect bridge (EMIB) is a novel packaging technology that can provide high density interconnects between heterogeneous dies on a single package by embedding a small silicon bridge in the package substrate. This paper investigates the power delivery decoupling schemes for EMIB package for IO to IO communication interfaces, and also compared with EMIB packages for HBM application. The difference between the power delivery decoupling schemes for IO to IO communication interfaces and HBM application has been studied in this paper. A novel approach to implement MIM capacitors in the embedded bridge die which can significantly increase the decoupling capacitance is also proposed.