Influence of wirebond shape on its lifetime with application to frame connections

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2013-04-14 DOI:10.1109/EUROSIME.2013.6529909

B. Czerny, I. Paul, G. Khatibi, M. Thoben

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引用次数: 11

Abstract

The subject of this study was to investigate the effect of different geometrical loop shapes on the reliability of 400 μm thick Al bond wires in IGBT modules by means of experimental and analytical methods. The experimental fatigue tests have been realized by linear cyclic displacements of 5-45 μm of the contact plates at 200 Hz and 20 kHz. Life time curves were obtained for bond wire connections with different loop heights, distances and angles with the main failure mechanism being wire bond heel cracking. Furthermore an analytical model was developed to calculate the effect of variation of geometrical shape parameters on the stress at different locations of the bond wire. This model can be used to make a preliminary geometry selection of the bond wire and to predict the force or stress at critical sites of the wire bond during stress tests. This model was validated with finite element analysis.

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应用于框架连接时，焊丝形状对其寿命的影响

本文采用实验和分析相结合的方法，研究了不同几何回路形状对400 μm厚铝键合线IGBT模块可靠性的影响。在200 Hz和20 kHz下，对接触板进行5 ~ 45 μm的线性循环位移，实现了疲劳试验。得到了不同环高度、环距和环角的键合钢丝接头的寿命曲线，其主要失效机制为键合钢丝后跟开裂。此外，还建立了一个分析模型来计算几何形状参数的变化对焊丝不同位置应力的影响。该模型可用于粘结丝的初步几何形状选择，并在应力测试中预测粘结丝关键部位的力或应力。通过有限元分析对模型进行了验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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