O. Faynot, L. T. Su, S. Cristoloveanu, C. Raynaud, J. E. Chung, A. Auberton-Herve, D. Antoniadis
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引用次数: 1
Abstract
It is demonstrated that ultra-thin film (UTF) inversion-mode (IM) and accumulation-mode (AM) SIMOX MOSFETs behave similarly in terms of hot-carrier degradation. The primary degradation occurs at the interface which is activated but the effects of interface coupling can confuse lifetime predictions. Defects (such as in the buried oxide) must be clearly accounted for and decoupled in order to properly evaluate device lifetime. There was no evidence of significant enhanced degradation in ultra-thin films.<>
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