First-principle molecular model of PECVD SiOCH film for the mechanical and dielectric property investigation

N. Tajima, T. Hamada, T. Ohno, K. Yoneda, N. Kobayashi, T. Hasaka, M. Fnoue
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引用次数: 4

Abstract

The microstructure of PECVD carbon-doped oxide (SiOCH) film has been obtained for the first time by using a theoretical method to create molecular models of amorphous polymers with cross-links. This method generates atomic coordinates of chemically possible SiOCH film structures from a given atomic composition. We have confirmed that this method creates reasonable SiOCH film structures that explain the experimental results of IR spectrum, dielectric constant, and Young's modulus. Consequently, this method gives us a guideline for decreasing the density of PECVD SiOCH films having acceptable mechanical properties for interconnect applications.
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用于力学和介电性能研究的PECVD SiOCH薄膜第一性原理分子模型
通过建立交联非晶聚合物的分子模型,首次获得了PECVD掺杂碳氧化物(SiOCH)薄膜的微观结构。该方法从给定的原子组成生成化学上可能的SiOCH膜结构的原子坐标。我们已经证实,这种方法创造了合理的SiOCH薄膜结构,解释了红外光谱,介电常数和杨氏模量的实验结果。因此,该方法为降低具有可接受的机械性能用于互连应用的PECVD SiOCH薄膜的密度提供了指导。
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