Fully Integrated 300 GHz Receiver S-MMICs in 50 nm Metamorphic HEMT Technology

A. Tessmann, H. Massler, U. Lewark, S. Wagner, I. Kallfass, A. Leuther
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引用次数: 22

Abstract

Two fully integrated H-band (220-325 GHz) submillimeter-wave monolithic integrated circuit (S-MMIC) heterodyne receivers have been successfully developed, based on a 50 nm metamorphic high electron mobility transistor (mHEMT) technology. A fabricated fundamental down-conversion receiver achieved a conversion gain of more than 11 dB in the frequency range from 270 to 310 GHz with an LO power of only 12 dBm. Furthermore, a subharmonic receiver S-MMIC was developed, consisting of an active frequency multiplier by three, a two stage driver amplifier, a single-ended resistive mixer, and a four-stage low-noise amplifier, demonstrating a conversion gain of more than 12 dB from 290 to 320 GHz with a subharmonic LO-power of 8 dBm. Grounded coplanar waveguide (GCPW) topology in combination with cascode transistors resulted in a very compact die size of less than 1.25 mm^2.
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采用50nm变质HEMT技术的全集成300ghz接收机s - mmic
基于50 nm高电子迁移率晶体管(mHEMT)技术,成功开发了两个完全集成的h波段(220-325 GHz)亚毫米波单片集成电路(S-MMIC)外差接收器。自制的基频下转换接收机在270 ~ 310 GHz频率范围内实现了超过11 dB的转换增益,而本振功率仅为12 dBm。此外,还开发了一种次谐波接收器S-MMIC,由一个三倍频有源放大器、一个两级驱动放大器、一个单端电阻混频器和一个四级低噪声放大器组成,在290至320 GHz范围内的转换增益超过12 dB,次谐波lo功率为8 dBm。接地共面波导(GCPW)拓扑结构与级联晶体管相结合,导致非常紧凑的芯片尺寸小于1.25 mm^2。
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