Model to hardware matching for nano-meter scale technologies

S. Nassif
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引用次数: 7

Abstract

With technology scaling becoming ever more difficult, the drive to continue to deliver performance and density has led to increasing technology complexity. Examples include the pervasive application of resolution enhancement techniques (RET) to enable sub-wavelength lithography and achieve circuit density, and strain engineering to improve device mobility and achieve circuit performance. The result of this increasing technology complexity has been a corresponding increase in the complexity of design/technology interaction. This phenomena demonstrates itself as a drastic increase in the number and complexity of design rules. Many of these rules are the result of the increase of the number and magnitude of systematic effects. In addition to these systematic sources of variability, we have an increasing host of random variations such as line edge roughness, which impacts channel lengths, and random dopant fluctuations, which impact threshold voltage. The net result has been a reduction in our ability to reliably predict the outcome of the manufacturing process. Given that the integrated circuit design process is based completely on our ability to create computer models of the expected behavior of a design, this gap in predictability is a source of grave concern. Model to Hardware matching attempts to close this gap by developing techniques, tools, and design components which can be used to improve technology predictability.
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纳米尺度技术的模型到硬件匹配
随着技术扩展变得越来越困难,继续提供性能和密度的动力导致了技术复杂性的增加。例子包括分辨率增强技术(RET)的广泛应用,以实现亚波长光刻和实现电路密度,以及应变工程,以提高器件的移动性和实现电路性能。技术复杂性增加的结果是设计/技术交互的复杂性相应增加。这种现象表现为设计规则的数量和复杂性的急剧增加。这些规则中的许多都是系统效应数量和程度增加的结果。除了这些系统的可变性来源之外,我们还有越来越多的随机变化,例如影响通道长度的线边缘粗糙度和影响阈值电压的随机掺杂波动。最终的结果是降低了我们可靠地预测生产过程结果的能力。考虑到集成电路设计过程完全基于我们创建设计预期行为的计算机模型的能力,这种可预测性的差距是一个严重关注的来源。模型到硬件匹配试图通过开发可用于提高技术可预测性的技术、工具和设计组件来缩小这一差距。
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