T. Mitze, M. Schnarrenberger, L. Zimmermann, J. Bruns, F. Fidorra, F. Kreissl, K. Janiak, H. Heidrich, K. Petermann
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引用次数: 2
Abstract
A concept for a SOI motherboard is introduced. AuSn solder technology is used for hybrid integration. The device adjustment on the board is realised by passive self-alignment. First results on fabricated boards are very encouraging.
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