Integration of polymer bonded magnets into magnetic sensors

K. Elian, H. Theuss
{"title":"Integration of polymer bonded magnets into magnetic sensors","authors":"K. Elian, H. Theuss","doi":"10.1109/ESTC.2014.6962754","DOIUrl":null,"url":null,"abstract":"This paper introduces a novel assembly and manufacturing technology for integrating permanent magnets into magnet sensor modules by use of plastic bonded magnets. High precision speed sensors in automotive applications, e.g. in anti-blocking-system or engine management, are based on a magnetic measurement principle [1]. Typical sensor modules contain a semiconductor based sensor chip and a permanent magnet providing the necessary bias field (see Fig. 1). This field is modulated by a passing external gear wheel out of material with high magnetic permeability, which is part of the magnetic circuit. The wheel speed can directly be determined by measuring the frequency of the magnetic field modulation. Permanent magnets are often assembled in a sequential pick and place process. We report a novel assembly technology by direct molding of thermoplast bonded magnets onto a chip carrier containing pre-assembled sensors. We will show, that this offers the following advantages: - Highest accuracy - Optimum working point, in particular for GMR sensors - High throughput by efficient parallel process - Simplification of the module assembly.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"135 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962754","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13

Abstract

This paper introduces a novel assembly and manufacturing technology for integrating permanent magnets into magnet sensor modules by use of plastic bonded magnets. High precision speed sensors in automotive applications, e.g. in anti-blocking-system or engine management, are based on a magnetic measurement principle [1]. Typical sensor modules contain a semiconductor based sensor chip and a permanent magnet providing the necessary bias field (see Fig. 1). This field is modulated by a passing external gear wheel out of material with high magnetic permeability, which is part of the magnetic circuit. The wheel speed can directly be determined by measuring the frequency of the magnetic field modulation. Permanent magnets are often assembled in a sequential pick and place process. We report a novel assembly technology by direct molding of thermoplast bonded magnets onto a chip carrier containing pre-assembled sensors. We will show, that this offers the following advantages: - Highest accuracy - Optimum working point, in particular for GMR sensors - High throughput by efficient parallel process - Simplification of the module assembly.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
聚合物粘结磁体与磁传感器的集成
介绍了一种利用塑料粘结磁铁将永磁体集成到磁体传感器模块中的新型装配制造技术。汽车应用中的高精度速度传感器,例如防堵系统或发动机管理,都是基于磁测量原理[1]。典型的传感器模块包含一个基于半导体的传感器芯片和一个提供必要偏置场的永磁体(见图1)。该偏置场由高磁导率材料通过的外部齿轮调制,该材料是磁路的一部分。通过测量磁场调制频率可以直接确定车轮转速。永磁体通常在连续的取放过程中组装。我们报告了一种新的组装技术,将热塑性粘结磁铁直接成型到包含预组装传感器的芯片载体上。我们将证明,这提供了以下优势:-最高精度-最佳工作点,特别是对于GMR传感器-高效并行处理的高吞吐量-简化模块组装。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer Influence of soft sensor chip bonds on the formation of wire bond interconnections Integrated printed hybrid electronics on paper Flip-chip bonding processes with low volume SoP technology Reliability performance of Au-Sn and Cu-Sn wafer level SLID bonds for MEMS
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1