Keeping Both Sides Winning: Wafer Fabrication Equipment Suppliers And Semiconductor Manufacturers In The Year 2000 And Beyond

Maydan
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Abstract

Global demand for semiconductor IC solutions has kept both semiconductor manufacturers and wafer fabrication equipment suppliers in a state of rapid growth since the 1970's. As the next century approaches, new manufacturing challenges arise due to decreasing feature sizes, increasing metal layers, and the transition to 300" wafer size. Technology and productivity shifts such as these represent tremendous economic risks for both semiconductor manufacturers and equipment suppliers. This paper will briefly discuss historical drivers of growth for both semiconductor manufacturers and equipment suppliers, examine semiconductor manufacturers' priorities for the year 2000 and beyond, discuss equipment trends for the 2lSt century, and highlight winning strategies for the next century for wafer processing.
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保持双方共赢:2000年及以后的晶圆制造设备供应商和半导体制造商
自20世纪70年代以来,全球对半导体集成电路解决方案的需求使半导体制造商和晶圆制造设备供应商处于快速增长的状态。随着下个世纪的临近,由于特征尺寸的减小、金属层的增加以及向300英寸晶圆尺寸的过渡,新的制造挑战出现了。诸如此类的技术和生产力转变对半导体制造商和设备供应商来说都是巨大的经济风险。本文将简要讨论半导体制造商和设备供应商增长的历史驱动因素,研究半导体制造商在2000年及以后的优先事项,讨论21世纪的设备趋势,并强调下个世纪的晶圆加工制胜战略。
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