Applications and design techniques for MCMs

E. Davidson
{"title":"Applications and design techniques for MCMs","authors":"E. Davidson","doi":"10.1109/MCMC.1994.292527","DOIUrl":null,"url":null,"abstract":"The multi-chip module (MCM) has yet to make its mark in the high volume computer arena but this situation should change soon. High chip and module connection densities are the drivers that will ultimately make MCMs the choice for many applications. Of course, for this to happen, they will have to be cost competitive when compared to alternative approaches. This, too, will happen. As a result, the art of designing an MCM will become a desirable skill. Designing an MCM is the first step in determining whether your application should include an MCM. This paper shows how to do that.<<ETX>>","PeriodicalId":292463,"journal":{"name":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1994.292527","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The multi-chip module (MCM) has yet to make its mark in the high volume computer arena but this situation should change soon. High chip and module connection densities are the drivers that will ultimately make MCMs the choice for many applications. Of course, for this to happen, they will have to be cost competitive when compared to alternative approaches. This, too, will happen. As a result, the art of designing an MCM will become a desirable skill. Designing an MCM is the first step in determining whether your application should include an MCM. This paper shows how to do that.<>
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
mcm的应用和设计技术
多芯片模块(MCM)尚未在大容量计算机领域取得成功,但这种情况应该很快就会改变。高芯片和模块连接密度是驱动因素,最终将使mcm成为许多应用的选择。当然,要做到这一点,与其他方法相比,它们必须具有成本竞争力。这也将会发生。因此,设计MCM的艺术将成为一种理想的技能。设计MCM是确定应用程序是否应该包含MCM的第一步。本文展示了如何做到这一点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
The ARPA (ASEM) MCM brokerage service Latent open testing of electronic packaging Modeling of Delta-I noise in digital electronics packaging A pragmatic test and diagnosis methodology for partially testable MCMs A silicon-on-silicon multichip module technology with integrated bipolar components in the substrate
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1