Kye-Weon Kim, Yusin Yang, Chung Sam Chun, Sang Mun Chun, Dong Chun Lee, Sun-Yong Choi, S. Choi, Sung Jin Park
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引用次数: 0
Abstract
In CMP(Chemical Mechanical Polishing) process, if there are defects on the polishing pad, scratches are generated on the surface of the semiconductor wafer. We developed the inspection system of defects on the chemical mechanical polishing pad. The system uses a white light source and a CCD camera in order to inspect defects. We use the threshold method in order to find defects from images captured by the CCD camera, and the system can sort defects by size.
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